The optical inspection of solder joints supports all users in the electronic manufacturing environment in their drive to ensure their production quality. Ersa inspection systems are worldwide the only systems that enable its user to view, with its patented endoscope optic, hidden solder joints, for example joints on a ball grid array.
Perfect Assessment of the Solder Joint
Live images of the solder joint with a 700 fold magnification permit the assessment of the solder joint like no other system. ERSASCOPE systems optimally complement the following test methods:
- automatic X-ray inspection (AXI)
- automatic optical inspection (AOI)
- In-Circuit-Test (ICT)