Ersa explains #4.4 - BGA soldering

In part four Ersa finally shows important topics during installation of a new BGA component

In part four Ersa finally shows important topics during installation of a new BGA component. A temperature profile adopted to the thermal requirement of the assembly guarantees safe soldering of the previously placed Ball Grid Array.

 

Links to the related products:

Ersa HR 550 Ersa HR 600/2