ERSASCOPE 2 XL

Artikel-Nr.: 0VSSC600X
High end BGA inspection systems for BGA, µBGA, CSP, Flip Chip and other hidden solder joints on particularly large PCBs

ERSASCOPE 2 XL inspection system (0VSSC600X)
ERSASCOPE 2 XL inspection system (0VSSC600X)
ERSASCOPE 2 XL inspection system with PCB
Inspection software ImageDoc EXP
   
 
 

ERSASCOPE 2 XL - the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints on particularly large PCBs

  • High-end endoscope inspection system including three quick change heads:
    - 90° BGA head (approx. 280 µm clearance)
    - 90° Flip Chip head (approx. 30 µm clearance)
    - 0° wide angle head, e.g. for VIA inspection without tilting of optics
  • 6 Movement axes for flexible adjustment to
    practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality 1.3 megapixel CCD colour camera with USB connection
  • XY rotary table in XL version with fine adjust wheels, freely positionable under the optics
  • Optics extraction unit for the inspection of front components on particularly deep PCBs
  • Optimal light management:
    - inspection heads with fibre optic stereo front light
    - mechanically coupled, swivelling and rotating backlight
    - fibre optic gooseneck for targeted lighting from all sides
    - separate setting of light quantity for all light guides
    - with light brushes, light extension and iris aperture
  • Focusing scale to be used with calibration groups
    in the ImageDoc EXP measuring function
  • Complete set with the most important accessories and storage case

Technical Data

ERSASCOPE Stand
Dimensions (W x D x H) in mm
500 x 520 x 400
Weight in kg
6
Style
Aluminium die casting, Z-axis with XL extracting unit and micrometer adjustment; intake for ERSASCOPE inspection optics
Antistatic Design (y/n)
yes
Connection
Fibre optic light brushes with LEMO connectors for ERSASCOPE optics and 15 mm connector plug for light source, additional 1,000 mm light guide gooseneck for light brush, integrated USB 2.0 camera connection (USB-A/mini USB)
ERSASCOPE 2 Base Station
Total length in mm
155
Weight in g
170
Principle
Optical endoscope system
Style
Stainless steel, integrated optics, directed lighting via integrated optical fibre light guide
Light control
Separate iris for front and back lights
Backlight attributes
Mechanically connected, height-adjustable, pivoting in two axis, changeable deflecting prism
Focus adjustment
Focus ring with micrometer scale (for ImageDoc EXP calibration groups)
Connection
LEMO connector for light supply, quick-exchange connector for ERSASCOPE 2 inspection heads, optical outlet M12x1 (C-mount via TV-adapter)
Interchangeable optics 90° BGA Head
Style
Stainless steel, integrated optic, stereo light via fiber optics, reinforced prism deflecting prism 90°
Application
Inspection of concealed solder joints for gap dimensions 100 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm
32
Weight in g
approx. 4
Magnification
up to 425x (native on a 20" TFT monitor with 1,600 x 1,200 pixels)
Footprint
3 mm x 6 mm
Field angle
23°
Focus range
0 - ? mm
Interchangeable optics 90° Flip Chip Head
Style
Stainless steel, integrated optic, stereo light via fibre optics, mirror deflecting optic 90°
Application
Inspection of concealed solder joints for gap dimensions 100 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm
27
Weight in g
3
Magnification
up to 700x (native on a 20" TFT monitor with 1,600 x 1,200 pixels)
Footprint
1,5 mm x 4,5 mm (0,6 mm x 4,0 mm)
Field angle
23°
Focus range
0 - ? mm
Interchangeable optics 0° top view head
Style
Stainless steel, integrated optic, three-point light via fibre optics
Application
Top view inspection with wide-angle view at a high magnification
Total length in mm
24
Weight in g
5
Magnification
up to 250x (native on a 20" TFT-monitor with 1,600 x 1,200 pixels)
Footprint
Diameter 6 mm
Field angle
38°
Focus range
3 - ? mm
Inspection camera
Style
Premium CCD colour camera with digital image transmission
Resolution
1,280 x 1,024 pixel (1,3 megapixel, SXGA, 4:3, sensor 1/3")
Connection
C-Mount lens connector, USB 2.0
Energy supply
via USB 2.0
Light source
Style
High power LED light source, ca. 5,800 K colour of light
Brightness
approx. 470 lm with fused fibre 5 mm, approx. 640 lm with fibre 8 mm (1,000 mm length)
Life span
approx. 30,000 h (70% brightness)
Power consumption
max. 65 W
Energy supply
24 V DC / 5420 mA
Nominal voltage in V AC
100 - 240 (wall wart 24 V DC outlet)
Test symbol
CE
Weight in kg
2,1
Antistatic Design (y/n)
yes
Dimensions (W x D x H) in mm
170 x 196 x 98
Connection
15 mm connector light outlet, ESD bush, DC bush, USB 2.0 for remote control, jack connector 2,5 mm for pedal switch
Inspection table
Style
XY table XL version with fine adjustment, rotatable, mounted on ball bearing, aluminium, with eight additional support pins
Dimensions (W x D x H) in mm
700 x 600 x 90
Traversing range
560 mm in X, 300 mm in Y direction (in combination with extracting unit 600 mm)
Weight in kg
15
Antistatic Design (y/n)
yes

Available Versions

The following product versions or modules are available:

ERSASCOPE 2 XL inspection system
ERSASCOPE 2 XL inspection system

Article No.: 0VSSC600X
 

Application

Inspection of hidden solder joints and more

Extreme flexibility due to seven movement axes for the inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections. The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. without tilting the optics (through the shift method)! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option)!

BGA Inspektion mit 90° BGA-Optik
FlipChip Inspektion mit 90° FlipChip-Optik
QFP Fersenfüllung Inspektion mit 90° BGA-Optik
Inspect the wall through contacting with 0° inspection optics, without tilting!
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

ImageDoc v3 EXP
ImageDoc v3 EXP

Purchase key to activate the full range of functions of the ImageDoc v3 inspection software

Article No.: 0VSID300L
MACROZOOM optics

Zoom lens for quick top view inspection with high enlargements

Article No.: 0VSMZ100
MACROZOOM holder (uEye 2240)

Holder of Ersa uEye 2240 inspection camera with MACROZOOM lens

Article No.: 0VSMZ200H
MACROZOOM ring light

Fibre ring light for MACROZOOM lens

Article No.: 0VSFR100
XL Upgrade Kit

For the inspection of particularly large assembly units with the ERSASCOPE Systemen

Article No.: 0VSUP6XL
 

More accessory you will find in the Ersa Shop.

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