ERSASCOPE 2

Article No.: 0VSSC600
High end inspection system for BGA, µBGA, CSP, Flip Chip and other hidden solder joints

ERSASCOPE 2 Inspection System (0VSSC600)
ERSASCOPE 2 Inspection System (0VSSC600)
Ersa ImageDoc v3 inspection software
Benefits Ersascope
   
 
 

Videos

ERSASCOPE – optical solder joint inspection – product video

 

ERSASCOPE 2 - the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints

  • High end endoscope inspection system
    including three quick change heads:
    - 90° BGA head (approx. 280 µm clearance)
    - 90° Flip Chip head (approx. 30 µm clearance)
    - 0° wide angle head, e.g. for VIA inspection without tilting of optics
  • 7 movement axes for flexible adjustment to
    practically every required viewing angle
  • High-performance, dimmable LED lighting in daylight colour
  • High quality 1.3 megapixel CCD colour camera with USB connection
  • XY rotary table with fine adjust wheels, freely positionable under the optics
  • Optimal light management:
    - inspection heads with fibre optic stereo front light
    - mechanically coupled, swivelling and rotating backlight
    - fibre optic gooseneck for targeted lighting from all sides
    - separate setting of light quantity for all light guides
    - with light brushes, light extension and iris aperture
  • Focusing scale to be used with calibration groups in the
    ImageDoc EXP measuring function
  • Complete set with the most important accessories and storage case

 

Questions about the product? Please find your personal contact here.

Technical Data

ERSASCOPE Stand
Dimensions (W x D x H) in mm
500 x 520 x 400
Weight in kg
5
Style
Aluminium die casting, Z-axis micrometer adjustment; intake for ERSASCOPE inspection optics
Antistatic Design (y/n)
yes
Connection
Fibre optic light brushes with LEMO connectors for ERSASCOPE optiks and 15 mm connector plug for light source, additional 1,000 mm light guide gooseneck for light brush, integrated USB 2.0 camera connection
Inspection optic ERSASCOPE 2 basic unit
Total length in mm
155
Weight in g
170
Principle
Optical endoscope system
Style
Stainless steel, integrated optics, directed lighting via integrated optical fibre light guide
Light control
Separate iris for front and back lights
Backlight attributes
Mechanically connected, height-adjustable, pivoting in two axis, changeable deflecting prism
Focus adjustment
Focus ring with micrometer scale (for ImageDoc EXP calibration groups)
Connection
LEMO connector for light supply, quick-exchange connector forERSASCOPE inspection heads, optical outlet M12x1 (C-mount via TV-adapter)
Interchangeable optics 90° BGA Head
Style
Stainless steel, integrated optic, stereo light via fibre optics, reinforced prism deflecting prism 90°
Application
Inspection of concealed solder joints for gap dimensions 100 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm
32
Weight in g
ca. 4
Magnification
up to 425x (native on a 20" TFT-Monitor with 1,600 x 1,200 pixels)
Footprint
3 mm x 6 mm
Field angle
23°
Focus range
0 - ? mm
Interchangeable optics 90° Flip Chip Head
Style
Stainless steel, integrated optics, stereo light via fibre optics, mirror deflecting optic 90°
Application
Inspection of concealed solder joints for gap dimensions 100 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm
27
Weight in g
3
Magnification
up to 700x (native on a 20" TFT-Monitor with 1,600 x 1,200 pixels)
Footprint
1,5 mm x 4,5 mm (0,6 mm x 4,0 mm)
Field angle
23°
Focus range
0 - ? mm
Interchangeable optics 0° top view head
Style
Stainless steel, integrated optics, three-point light via fibre optics
Application
Top view inspection with wide-angle view at a high magnification
Total length in mm
24
Weight in g
5
Magnification
up to 250x (native on a 20" TFT-monitor with 1,600 x 1,200 pixels)
Footprint
Diameter 6 mm
Field angle
38°
Focus range
3 - ? mm
Inspection Camera
Style
Premium CCD colour camera with digital image transmission
Resolution
1,280 x 1,024 pixel (1,3 megapixel, SXGA, 4:3, sensor 1/3")
Connection
C-mount lens connector, USB 2.0
Energy supply
via USB 2.0
Light source
Style
High power LED light source, ca. 5,800 K colour of light
Brightness
approx. 470 lm with fused fibre 5 mm, approx. 640 lm with fibre 8 mm (1,000 mm length)
Life span
approx. 30,000 h (70% brightness)
Power consumption
max. 65 W
Energy supply
24 V DC / 5420 mA
Nominal voltage in V AC
100 - 240 (wall wart 24 V DC outlet)
Test symbol
CE
Weight in kg
2,1
Antistatic Design (y/n)
yes
Dimensions (W x D x H) in mm
170 x 196 x 98
Connection
15 mm connector light outlet, ESD bush, DC bush, USB 2.0 for remote controll, jack connector 2.5 mm for pedal switch
Inspection table
Style
XY table with fine adjustment, rotatable, mounted on ball bearing, aluminium, with four additional support pins
Dimensions (W x H) in mm
diameter 320 x 80
Traversing range
80 mm in X and Y direction, 360° rotatable, lockable in 90° steps
Weight in kg
5
Antistatic Design (y/n)
yes

Available Versions

The following product versions or modules are available:

ERSASCPOPE 2 complete system
ERSASCPOPE 2 complete system

Highly flexible inspection of hidden solder joints & more

Article No.: 0VSSC600
 

Application

Inspection of hidden solder joints and more

Extreme flexibility due to seven movement axes for the inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections. The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. without tilting the optics (through the shift method)! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option)!

BGA inspection with 90° BGA optics
BGA ball inspected by ERSASCOPE 2 90° BGA optics
FlipChip inspection with 90° FlipChip optics
µBGA ball inspected by ERSASCOPE 2, 90° FlipChip optics
QFP heel filling inspection with 90° BGA optics
Inspect the wall of a VIA with 0° inspection optics, without tilting!
FocusFusion Image of a BGA
Focus fusion image of a QFP
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

ImageDoc v3 EXP
ImageDoc v3 EXP

Purchase key to activate the full range of functions of the ImageDoc v3 inspection software

Article No.: 0VSID300L
MACROZOOM optics
MACROZOOM optics

Zoom lens for quick top view inspection with high enlargements

Article No.: 0VSMZ100
MACROZOOM holder (uEye 2240)
MACROZOOM holder (uEye 2240)

Holding Ersa inspection camera uEye 2240 with MACROZOOM lens

Article No.: 0VSMZ200H
MACROZOOM ring light
MACROZOOM ring light

Fibre ring light for MACROZOOM lens

Article No.: 0VSFR100
XL Upgrade Kit

For the inspection of particularly large assembly units with ERSASCOPE systems

Article No.: 0VSUP6XL
 

More accessory you will find in the Ersa Shop.

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