Article-No.: 0PR100
The Ersa Dip&Print Station enables the user of Ersa rework systems to perform component preparation (application of solder paste and flux) easily, reliably and reproducibly. Optional dip stencils allow components to be dipped into flux or solder paste in a defined manner, thus creating a defined depot of solder connections.
From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs - Ersa rework systems offer the optimal solution for all applications.
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