HR 100

Artikel-Nr.: 0IRHR100A
Compact Hybrid Rework System, hand-operated or stationary operation

Ersa HR 100 Rework System (0IRHR100A)
Ersa HR 100 Rework System (0IRHR100A)
Ersa Hybrid Rework System HR 100, complete set (0IRHR100A-HP)
Ersa HR 100 (0IRHR100A-HP) with Reflow Process Camera (0VSRPC500-LE)
Operating Software IRSoft
Ersa Rework System HR 100 with stand (0IRHR-ST050)
Ersa HR 100 application
   
 
 

The beginning of professional assembly unit repair: HR 100 - flexible hybrid rework!

  • Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
  • Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
  • Exchangeable hybrid adaptors of various sizes direct up to 200 W of heating energy specifically to the component
  • No blowing away of neighbouring components
  • Optionally available with stand, 800 W IR bottom heating  and PCB intake
  • Vac Pen for safe handling of devices
  • Operation software IRSoft

Technical Data

HR 100 Base Station
Dimensions (W x D x H) in mm
211 x 220 x 168
Weight in kg
4.5
Antistatic Design (y/n)
y
Power Rating in W
200
Nominal voltage in V AC
230
Upper heating
200 W (Hybrid Tool)
Component size in mm
1 x 1 bis 20 x 20
Operation
One-touch operating button or Windows PC
Test symbol
CE
Hybrid Tool
Length in mm
Supply 1,350
Weight in kg
0.3
Power Rating in W
200
Antistatic Design (y/n)
y
HP 100 Heating Plate with Stand
Dimensions (W x D x H) in mm
200 x 260 x 53,5
Weight in kg
2,5
Antistatic Design (y/n)
y
Power Rating in W
800
Nominal voltage in V AC
230
PCB size in mm
from 20 x 20 to ~ 290 x 250
Test symbol
CE

Application

Universal soldering and unsoldering of SMDs

Flexible desoldering and soldering of all types of surface mounted devices (SMD), e.g. chips up to 0402 SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; maximum recommended device size: 20 x 20 mm.

 

Handling of components with Vac Pen or SMD tweezer (not included in the delivery) or for stationary unsoldering with optional vacuum pipette (0IRHP100A-13).

SMD components
SOIC unsoldering
Transistor (TO-220) unsoldering
CSP application
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Hybrid Rework Stand, single
Hybrid Rework Stand, single

for the intake of the Hybrid Tool; use with basis system

Article No.: 0IRHR-ST050
Vacuum Pipette complete
Vacuum Pipette complete

for HR 100 (0IRHR100A-HP)

Article No.: 0IRHP100A-13
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

Hybrid Rework System HR 100
Hybrid Rework System HR 100

Basic system

Article No.: 0IRHR100
Hybrid Rework System HR 100, complete
Hybrid Rework System HR 100, complete

with heating plate, stand and intake for Hybrid Tool

Article No.: 0IRHR100-HP
Hybrid Rework System HR 100, without vacuum pump
Hybrid Rework System HR 100, without vacuum pump

Basic system, LE version

Article No.: 0IRHR100A-LE
Hybrid Rework System HR 100, without vacuum pump, complete
Hybrid Rework System HR 100, without vacuum pump, complete

Complete system, LE version

Article No.: 0IRHR100A-HP-LE
 

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