HR 600/2

Article No.: 0HR600/2
Hybrid Rework System - automatic desoldering, placement and soldering of SMT components

Hybrid Rework System HR 600/2
Hybrid Rework System HR 600/2
Placement of BGA component with HR 600/2
X-ray of an MLF after rework
Desoldering of component with HR 600/2
Hybrid heating head with interchangeable baffles
Screenshot HRSoft
Benefits HR 600/2
X-ray of an MLF after rework
Hybrid Rework System HR 600/2
Benefits HR 600/2
   
 
 

Videos

Hybrid Rework System Ersa HR 600/2

Ersa HR 600/2 - Trailer

Ersa Hybrid Rework System HR 600

 

New definition of board repair -
automatic, flexible and process reliable!

  • Highly efficient 800 W hybrid heating head
  • Homogeneous, large-area IR bottom heating with 3 heating zones (800 W each)
  • Automatic and precise component alignment with the help of machine vision
  • Highly accurate, motor-driven axis system
    for component placement (+/- 0.025 mm)
  • User independent, reproducible repair results guaranteed
  • Process control and documentation via the operator software HRSoft
  • Fully automatic or semiautomatic operation
  • Suitable for the use of the Dip&Print Station

  • Version HR 600/2 VOIDLESS upon request!

 

Questions about the product? Please find your personal contact here.

Technical Data

Dimensions (W x D x H) in mm
850 x 660 x 620
Weight in kg
57
Antistatic Design (y/n)
y
Power Rating in W
3,200
Nominal voltage in V AC
230
Compressed air connection
6-10 bar (free of oil), 1/4 inch quick bar connect
Upper heating
Hybrid emitter (2 x 400 W), 60 x 60 mm
Lower heating
IR emitter (3 x 800 W), 380 x 250 mm
PCB size in mm
from 20 x 20 to 390 x 285 (+x)
Component size in mm
from 1 x 1 to 50 x 50
Operation
Windows PC
Test symbol
CE
Option
reflow process camera: 10 MP CMOS USB color camera, 25 mm focal width; lighting: 2x LED point light source, dimmable

Application

Automatic repair process:

Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of up to 1 x 1 mm.

BGA
BGA base
CBGA
QFN
QFP
SMD Components
CSP Rework
MLF to rework
X-ray of MLF after rework
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Ersa Reflow Process Camera for HR 600/2
Ersa Reflow Process Camera for HR 600/2

for observation of the soldering process

Article No.: 0HR610P
AccuTC Sensor without fixture
AccuTC Sensor without fixture

K type for the second measuring channel

Article No.: 0IR6500-37
AccuTC 2.0 Thermocouple
AccuTC 2.0 Thermocouple

K type, for the second measuring channel

Article No.: 0HR645
Temperature Sensor Cord
Temperature Sensor Cord

K type, for the second measuring channel

Article No.: 0IR4510-02
TE Holder for HR 600
TE Holder for HR 600

suitable for AccuTC and AccuTC 2.0

Article No.: 0HR640
PCB Holder HR 600/2 (big)
PCB Holder HR 600/2 (big)

for plate size up to 300 x 535 mm

Article No.: 0HR635
Micro-Pickup Type 0510
Micro-Pickup Type 0510

Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm

Article No.: 0IR5500-40 + 0IR4520-07
 

Additional products

More accessories you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

HR 600/2 Hybrid Rework System
HR 600/2 Hybrid Rework System

Article No.: 0HR600/2
HR 600/2 with lowered bottom heating
HR 600/2 with lowered bottom heating

Article No.: 0HR600/2BHL
HR 600/2 with PCB holder 300 x 535 mm
HR 600/2 with PCB holder 300 x 535 mm

Article No.: 0HR600/2L
HR 600/2 with PCB holder 300 x 535 mm and lowered bottom heating
HR 600/2 with PCB holder 300 x 535 mm and lowered bottom heating

Article No.: 0HR600/2LBHL
HR600/2 VOIDLESS
HR600/2 VOIDLESS

Article No.: 0HR600/2 and 0HR-VL1
 

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