Flexible assembly unit repair
All types of SMD of 1 x 1 up to 40 x 40 mm can be processed. Flexible desoldering, placement and soldering of surface mounted devices (SMD), e.g. chips up to 0402, SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; plastic BGA components are a typical rework application for the IR 550 system; for QFP components an optional split optics cassette is available.
As nozzles are not required, even special components like shielding plates or plugs can be processed very well.
Questions to your applications will be answered by our Ersa Experts.