IR / PL 550

Artikel-Nr.: 0IR550A & 0PL550A
Highly flexible IR Rework System with precise component placement

Ersa IR / PL 550 Rework System (PC & monitor optional at request)
Ersa IR / PL 550 Rework System (PC & monitor optional at request)
IR 550 Rework System (0IR550A)
PL 550 Precision Placement System (0PL550A)
XY-PCB table
Ersa IR / PL 550 Rework System
Reflow process camera for observing the molten solder
   
 
 

Worldwide, thousands of customers trust the Ersa IR/PL 550 rework system!

  • IR 550 with an 800 W heating head with aperture system
  • Homogeneous 800 W IR bottom heating
  • Integrated "DIGITAL 2000 A" solder station for rework and removal of residual solder
  • Closed temperature control circuit with thermocouple or non-contact sensor
  • Precision placement system PL 550 (+/- 0.025 mm) with motor zoom AF camera, high-contrast LED lighting and vacuum that switches automatically
  • Motor zoom reflow process camera for process viewing
  • Intuitive operation with or without PC connection
  • Process control and documentation via the operator software IRSoft
  • Suitable for the use of the dip & print station

Technical Data

IR 550 Rework System
Dimensions (W x D x H) in mm
300 x 380 x 315
Weight in kg
9.75
Antistatic Design (y/n)
y
Power Rating in W
1,600
Nominal voltage in V AC
230
Upper heating
IR emitter 800 W
Lower heating
IR emitter 2 x 400 W
PCB size in mm
from 20 x 20 to ~ 300 x 340
Component size in mm
1 x 1 to 60 x 60
Operation
Keyboard or Windows PC
Test symbol
CE, VDE
PL 550 Precision Placement System
Dimensions (W x D x H) in mm
900 x 590 x 454
Weight in kg
21
Antistatic Design (y/n)
y
Power Rating in W
20
PCB size in mm
from 20 x 20 to ~ 400 x 340
Nominal voltage in V AC
230
Component size in mm
1 x 1 to 40 x 40
Placement accuracy in mm
up to +/- 0,025
Zoom factor
18 x optical and 4 x digital
Operation
Keyboard
Test symbol
CE
Reflow Process Camera module
Style
PAL CCD mootor zoom camera with dimmable LED ring light
Zoom factor
18 x optical and 4 x digital

Application

Flexible assembly unit repair

All types of SMD of 1 x 1 up to 40 x 40 mm can be processed. Flexible desoldering, placement and soldering of surface mounted devices (SMD), e.g. chips up to 0402, SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; plastic BGA components are a typical rework application for the IR 550 system; for QFP components an optional split optics cassette is available.


As nozzles are not required, even special components like shielding plates or plugs can be processed very well.

SMD components
BGA Graphic Processing Unit
SMD connector
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Split Optics Cassette
Split Optics Cassette

for PL550

Article No.: 0PL500A-SPC
Additional PCB Holder
Additional PCB Holder

for Ersa IR/PL 500 and IR/PL 650

Article No.: 0IR6500-17
Board Holder
Board Holder

Article No.: 0PH360
Flexpoint TE Holder
Flexpoint TE Holder

for AccuTC thermocouple

Article No.: 0IR5500-53
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

IR 550 Rework System
IR 550 Rework System

Article No.: 0IR550A
Precision Placement System PL 550 A
Precision Placement System PL 550 A

with Reflow Process Camera

Article No.: 0PL550A
Precision Placement System PL 550 A
Precision Placement System PL 550 A

retrofit with Reflow Process Camera

Article No.: 0PL550AU
Reflow Process Camera retrofit kit
Reflow Process Camera retrofit kit

... here without swivel arm

Article No.: 0VSRPC-UKIT2
 

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