IR/PL 650

Article No.: 0IR650A & 0PL650A
High-performance, universal IR Rework System with semiautomatic component placement

Ersa IR/PL 650 Rework System (PC & monitor optional at request)
Ersa IR/PL 650 Rework System (PC & monitor optional at request)
Placing module (0PL650A)
BGA component at placing nozzle of PL 650
Reflow Process Camera module
Ersa IR / PL 650 application
   
 
 

The flexible rework powerhouse for challenging tasks

  • Four programmable heating zones in the top emitter 1,200 W
  • Five programmable heating zones in the bottom emitter 3,200 W
  • Integrated "DIGITAL 2000 A'' solder station for rework
    and removal of residual solder
  • Four thermocouple measuring channels and a non-contact IR sensor
  • Dynamic IR heating technology for large (460 x 560 mm) PCBs
  • High precision (+/- 0.025 mm) Auto Pick & Place with motor zoom AF camera
  • Intuitive operation with PC connection
  • Process control and documentation via the operator software IRSoft
  • Motor zoom reflow process camera for process viewing
  • Suitable for the use of the Dip&Print Station

 

Questions about the product? Please find your personal contact here.

Technical Data

IR 650 Rework System
Dimensions (W x D x H) in mm
794 x 602 x 462
Weight in kg
75
Antistatic Design (y/n)
y
Power Rating in W
3,600
Nominal voltage in V AC
230
Upper heating
IR emitter (4 x 300 W)
Lower heating
IR emitter (2 x 800 and 4 x 400 W)
PCB size in mm
from 20 x 20 to 460 x 560
Component size in mm
from 1 x 1 to 60 x 60
Operation
Windows PC
Test symbol
CE
PL 650 motor-driven Precision Placement System
Dimensions (W x D x H) in mm
200 x 700 x 690
Weight in kg
21
Antistatic Design (y/n)
y
Power Rating in W
50
Nominal voltage in V AC
100 - 230
PCB size in mm
from 20 x 20 to 460 x 560
Component size in mm
from 1 x 1 to 60 x 60
Placement accuracy in mm
up to 0.010 mm
Zoom factor
25 x optical and 12 x digital
Operation
Windows PC
Test symbol
CE
Reflow Process Camera module (RPC)
Style
PAL CCD motor zoom camera with dimmable LED ring light
Zoom factor
25 x optical and 12 x digital

Application

High-performance assembly unit repair

Flexible desoldering, placement and soldering of all types of surface mounted devices (SMD), especially: high mass BGA, metallic BGA, CGA, CCGA, BGA socket, multilayer boards or aluminium laminated substrate, BGA-multiway connector, large QFP, large PLCC, high pole THT components; for QFP components an optional split optics cassette is available.

SMD components
Ceramic CBGA
High-mass CGA
BGA plastic base at PL 650
PBGA on aluminium compound PCB
Printed Part lifting from template
QFP 208 landing zone with split optics cassette
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Split Optics Cassette
Split Optics Cassette

for PL 650

Article No.: 0PL6500-11
Additional PCB Holder
Additional PCB Holder

for Ersa IR/PL 550 and IR/PL 650

Article No.: 0IR6500-17
Micro-Pickup Type 0510
Micro-Pickup Type 0510

Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm

Article No.: 0IR5500-40 + 0IR4520-07
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

IR 650 Rework System
IR 650 Rework System

with reflow process camera

Article No.: 0IR650A
Motor-driven Precision Placement System PL 650
Motor-driven Precision Placement System PL 650

Article No.: 0PL650A
 

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