IR/PL 650 XL

Artikel-Nr.: 0IRPL650A-XL
XL Rework System with the highest heating performance (9,200 W) for large and complex boards

Ersa IR/PL 650 XL - maximum rework power for large assemblies
Ersa IR/PL 650 XL - maximum rework power for large assemblies
PCB holder
Plate over large-scale bottom emitter
Quick clamp
Support rail and pin
Bottom support rails
   
 
 

Maximum power - infinite performance for the very big rework jobs!

  • Four programmable heating zones in the top emitter 1,200 W
  • Five programmable heating zones in the bottom emitter 8,000 W
  • Minimum delay in assembly unit, complete surface heating on 500 x 625 mm
  • Foldable PCB frame with support rails and retaining element
  • Four thermocouple measuring channels and a non-contact IR sensor
  • High precision (+/- 0,025 mm) Auto Pick & Place with motor zoom AF camera
  • Intuitive operation with PC connection
  • Process control and documentation via the operator software IRSoft
  • Motor zoom reflow process camera for process viewing
  • Suitable for the use of the dip & print station

Technical Data

IR Modul
Dimensions (W x D x H) in mm
1,790 x 840 x 1,490
Weight in kg
ca. 185
Antistatic Design (y/n)
y
Power Rating in W
9,200
Nominal voltage in V AC
3 x 230 V/N/PE, CEE 16A
Compressed air connection
6-10 bar (free of oil), 1/4 inch quick coupling
Upper heating
IR emitter (4 x 300 W)
Lower heating
IR emitter (20 x 400 W) in five zones
PCB size in mm
up to 500 x 625
Component size in mm
from 1 x 1 to 60 x 60
Operation
Windows PC
Test symbol
CE
PL Module
Placement accuracy in mm
up to 0.010 mm
Zoom factor
25 x optical and 12 x digital
Reflow Process Camera (RPC)
Style
PAL CCD motor zoom camera with dimmable LED ring light
Zoom factor
25 x optical and 12 x digital

Application

Repair of large boards

Desoldering, placement and soldering of all types of surface mounted devices (SMD), preferably on large surface boards especially: high-mass BGA, metallic BGA, CGA, CCGA, BGA socket, multilayer boards or aluminium laminated substrate, BGA-multiway connector, large QFP, large PLCC, high pole THT components; for QFP components an optional split optics cassette is available.

High-mass CGA
LGA 775 processor base
BGA base
High-mass, ceramic Pin Grid Array
QFP 208 landing zone with split optics cassette
 

Options

Ersa recommends the following accessories:

Split Optics Cassette
Split Optics Cassette

for PL 650

Article No.: 0PL6500-11
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

Semiautomatic IR Rework System
Semiautomatic IR Rework System

for the repair of large boards

Article No.: 0IRPL650A-XL
 

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