Void reduction up to 98 %! Winner of the NPI Award 2016


Highlights Reflow System Ersa HOTFLOW 3/20

  • Excellent heat transfer with the most varied board assemblies
  • Rest-oxygen monitoring and control with low N2 consumption
  • Low energy consumption through intelligent energy management
  • Multi-level controlled cooling
  • Multi-level process gas cleaning system
  • "On the fly" maintenance for increased machine availability / uptime
  • Multi-track conveyor system (1-4 tracks)
  • Ersa Process Control (EPC) for continuous process monitoring
  • Ersa Auto Profiler software for quickly generating temperature profiles


... HOTFLOW 3/20 VOIDLESS technology

The HOTFLOW 3/20 VOIDLESS unifies the proven reflow technology with the innovative and patented

VOIDLESS technology. The VOIDLESS module can be switched on and off as needed providing our customers with the highest flexibility in the production process.

The voidless module is installed in an existing HOTFLOW 3/20, as an addition to the existing peak zones.

Thus, it is ensured that temperatures required to melt the solder paste to form a solder joint on a

high mass component is achieved at all times. Only a few seconds are sufficient to reduce the void

rate by up to 98% when compared to a standard reflow soldering process.

Technical data


  • Length: 6,590 mm
  • Width: 1,530 mm
  • Height: 1,450 mm
  • Weight appr. 3,200 kg

Conveyor system

  • Conveyor speed: 20-200 cm/min
  • Pin-and-chain conveyor with 3 / 4 / 5 mm pin length

Process zone

  • Process length: 5,190 mm
  • Heated length: 3,700 mm
  • Cooling length: 1,490 mm

Heating system

  • Convection heating cassettes
  • Volumetric flow rate each module adjustable up to 500 m3/h
  • Rated power each module: 3.3 kW


  • Up to 4 levels cooling zone with water back-cooling

Electrical data

  • 400 V, 3 Phase, N, Ground, 50/60 Hz
  • Continuous output during operation: appr. 12-19 kW


  • Extraction rate 2x 400 m3/h with monitoring feature

Technical Papers

Technical Papers online:

How to avoid Voids! (Kurtz Ersa Magazine 39)

HOTFLOW: Designed in Germany (Kurtz Ersa Magazin 38)