Ersa Solderlexicon

A
Adipic acid
Area ratio
Activators
Active component
Aging
Aluminum
Aluminum Substrate
Antimony
Axial component
Assembly
Alloy
Abkühlgradient
B
Blowholes
BGA / Ball Grid Array
Belt conveyor
Black pad
Bonding
Bronze
Bridging
Brush spray fluxer
Bundle
Brazing
Barrier Layer
Bismuth
C
Cooling gradient
Coefficient of expansion
Component
Crack
CAD
CAF
CAM
CEM basic material
Chemical silver
Chemical tin
Chip
Chip component
Chip bonding
Chip carrier
Chip on board
Chloride
Coffin Manson
Computer controlled soldering systems
Conformal coating
Connected solder balls
Crack
CTE
Concave fillet
Cold Solder Joint
Capillary Effect
Capton Tape
Ceramic Capacitor
Climate Test
Condensation Soldering
Condensate Trap
Condensation Management
Contact Time
Convection Reflow Systems
Convection Module
Corrosion
Cooling Module
Copper
Copper Wire Soldering
Copper Content in Solders
Copper Cladding
Copper Layers
Copper Migration
Copper Mirror Test
Chisel tip
Cleaning
Conformal Coating
Cycle Time
Conveyor Speed
Contaminated Solder
Cleaning
Cycle Time
D
Dissolution
Desoldering Iron
Desoldering
Delamination
DFM
DFR
Die
Die bonding
DIL/DIP
Diffusion
Diffusion zone
Dispenser
Dual wave soldering
Desoldering
Desoldering Iron
Desoldering Tweezers
Dewetting
Defect rate
Dip Soldering
Dross
Demand on soldering heat
Dull Solder Surface
Dewetting / Nonwetting
Dip Soldering
Drying
Dry Sponge
Destructive Test
E
Electrical test / Functional test
Electrolytic polishing
Electro migration
Electrostatics
Electrolytic capacitor (ELCAP)
Endoscope
Epoxy resin
ESD
Eutectics
Eutectic alloy
Enclosed print head
F
Fatigue failure
Fiducial marks
Fillet lifting
Fine Pitch
Finger conveyor
Flame retardants / Flame resistants'
Flat Packs
Flow characteristics
Flip Chip
Flux
Flux deposition
Flux density
Flux residue
Foot print
FR 2 board material
FR 4 board material
FR 5 board material
Freon
Functional test
Fiber glass
Fiducial Mark
Foam Fluxer
G
Gallium
Galvanically shaped stencil
Glass transition temperature
Gold
Gold surfaces
Gold impurity
Gradient
Graphical user interface
Gull Wing connection
H
Heat-up gradient
Hot-bar soldering
Humidity
Humidity sensitive components
Health protection
HAL Surface
Hand soldering
Hot Gas Soldering
Hot Air Knife
Hot-Belt Soldering
Heater Plate
Heating Zone / Heating Module
Hot Air Leveling
Hybrid Preheating
Hot Bar Soldering
Heat Radiation
I
Iron
IC
Induction Soldering
Imidazole
In Circuit Test
Indium
Induction Soldering
Inert Gas Soldering
Infrared heaters
Intermetallic Layer
Ionograph
IPC
Inert Gas Soldering
IR Reflow Ovens
J
JEDEC
Jet Wave
J-Lead
K
Kerko
Kovar
L
Lead
Lead
Lead-free solder
Limiting value
Lambda Nozzle or Wave
Laminate
Laser Soldering
Layout
Leaching
Leads
Leadframe
LED
Linear Profile
Liquidous Temperature
Low Melting Solders
M
Miss print
Microstructure
Manual placement
Main Solder Wave
Magnesium
Manhattan Effect
Multiple Soldering Processes
Multilayer Board
MELF Components
Meniscus
Measuring Board
Metal Content
Metallization
Metal-Core Substrate
Metal Stencil
Microvias
Miniwave Soldering
MID
Migration
Multi-Chip Module
Multilayer
Micro Sectioning
Moisture Absorption
N
Non-Eutectic Alloy
Nickel
Ni/CrNi Thermocouple
Nickel/Gold Surfaces
No Clean Flux
No Clean Process
Nitrogen Soldering
Number of Zones
O
Outgassing
Optical Inspection
Organic Electronics
OSP
Oxide
Oxidation
Oxide Skin
Over Printing
P
Pad
Paste release
Pick-and-Place unit
Placement offset
Pencil point tips
Printing speed
Print head
Printing offset
Plated-through holes
Precious metal
Plating
Printed circuit
Pulse Soldering
Particle Size
Plastic Squeegee
PCB surface finish
Pad
Pad Design
Pad Lifting
Palladium
Passive Components
Pick + Place
Pin in Paste
Pitch
Peak
Peak Zone
Phenolic Resin
Phenolic Resins Laminated Paper
Phosphor Pellets
Plasma Soldering
PLCC
Polymers
Polymer Electronic
Pop Corn Effect
PPM Value
Process Window
Process Monitoring
Pyrometer
Pitch / Contact Spacing
Pot Life
Preheating
Preheat Time
Pre-solder Wave / Chip Wave
Preferred Soldering Direction
Q
QFP
Quality Control
Quality Assurance
R
Resin
Rosin
Resistance to soldering heat
Rework
Radial Components
Reference Measuring Board
Reflow Soldering
Reflow Oven
Reflow Process Camera
Rework Soldering
Resistronic
Rest Oxygen Value
Rheology
Reliability
S
Snap-off
siehe LötrauchActivated carbon
siehe optische InspektionVisual Inspection
Solder pastes balling test
Single sided PCB
Strength
siehe Heißgas LötenHot Air Solder Iron
siehe LötrauchHEPA
siehe PyrometerInfrared Sensor
Slump
Solder Creep
Soft Beam Soldering
Solvent
Solderability
Solder Defect
Soldering Iron
Solder Pad
Soldering gun
Solder fume
Soldering Robot
Solder bridges
Solder Depot
Solder Preforms
Solder Balling Test
Solder Alloy
Solder Meniscus
Solder Paste
Solder Paste Printing
Solder Balls
Solder Pallet
Solder Fume Extractor
Solder Joint Inspection
Solder Resist/Solder Mask
Solder contamination
Solder Wave
Soldering Time
Sheathed Thermocouple
SMT Surface Mount Technology
Surface Tension
siehe Tip ReaktivatorPassivated soldering tip
Solder Paste Deposit
Squeegee
Squeegee Pressure
Squeegee Speed
Squeegee Angle
SEM
siehe StandbySleep mode
Saddle Profile
Stencil Printing
Self Centering
Selective Soldering
Sensotronic
SIL
Silver
Silver-Palladium Surfaces
Silver Migration
Screen Printing
SMD
SMT
SO Package
SOT Package
Spray Fluxer
Stand By
Stand Off
Static Solder Bath
Step Stencil
Separation Speed
Soft Soldering
T
Thick film technology
Thin film technology
Tomb stone effect
Track
Tackiness
Temperature Profile
Temperature Profile Measurement
Tempering
Thermal Expansion
Thermal Mass
Thermocouple
Thermography
Through Hole Reflow
Thixotropy
Tip Reactivator
Tolerance
Tombstone Effect
Twisting / Warping
Thermal Capacity
Time over Liquidus
Tin
Tin Based Solders
Tin Pest
U
Ultrasonic Soldering
Ultrasonic Microscopy
Ultrasonic Cleaning
V
Vapor phase soldering
Voids
Voids
Vacuum Soldering
Vapor Phase Soldering
Via
Viscosity of Solder Pastes
VOC free Fluxes
Void
W
Working window
Wetting
Wetting force
Wetting length
Wetting balance (Meniscograph)
Wetting angle
Wetting time
Wire bonding
Wave Soldering
Wave Soldering
Whisker
X
XRF
X-Ray Inspection
Z
Zero Defect Policy
Zinc