Pot Life

Pot life is the time period in which the property of a solder paste or SMD glue will not change; it counts starting with the time the container was opened. In practical terms, it gives a time frame during which the paste or the glue has to be used up in the printer.

Weitere Begriffe

Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting