ERSASCOPE 2 XL (discontinued)
Article No.: 0VSSC600X
High end BGA inspection systems for BGA, µBGA, CSP, Flip Chip and other hidden solder joints on particularly large PCBs. Product discontinued 08/2018.
ERSASCOPE 2 XL - the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints on particularly large PCBs
- High-end endoscope inspection system including three quick change heads:
- 90° BGA head (approx. 280 µm clearance)
- 90° Flip Chip head (approx. 30 µm clearance)
- 0° wide angle head, e.g. for VIA inspection without tilting of optics - 6 Movement axes for flexible adjustment to
practically every required viewing angle - High-performance, dimmable LED lighting in daylight colour
- High quality 1.3 megapixel CCD colour camera with USB connection
- XY table in XL version with fine adjust wheels, freely positionable under the optics
- Optics extraction unit for the inspection of front components on particularly deep PCBs
- Optimal light management:
- inspection heads with fibre optic stereo front light
- mechanically coupled, swivelling and rotating backlight
- fibre optic gooseneck for targeted lighting from all sides
- separate setting of light quantity for all light guides
- with light brushes, light extension and iris aperture - Focusing scale to be used with calibration groups
in the ImageDoc EXP measuring function - Complete set with the most important accessories and storage case
-- Product discontinued --
Alternative product: Ersascope M
Questions about the product? Please find your personal contact here.