Ersa at the Nepcon Shanghai 2016
Simultaneously to the SMT in Nurnberg the most important Asian fair of the electronic branch took place in Shanghai
Shanghai/Wertheim, May 03, 2016: On the Nepcon Shanghai system supplier Ersa showed everything from A to Z needed for the soldering process – from soldering tools among rework systems to large selective soldering systems. The main interest of the expert visitors were the latest Ersa products like the Hybrid Rework System HR 200, the Selective Soldering System VERSAFLOW 4 and the Reflow Soldering System HOTFLOW 3/20 VOIDLESS.
The HR 200 proofed its efficiency directly on site on the example of a customer PCB with small LED components – without any briefing true to the systems motto: UNPACK. SETUP. SOLDER!
The Ersa Selective Soldering System VERSAFLOW 4, which can be customized into detail according to any customer demand, impressed visitors by its extreme flexibility. With this, the latest generation of the VERSAFLOW sets the standard among the high-end selective soldering systems.
Another premier on the Asian market was the Ersa VOIDLESS technology, which as a result caused tremendous interest, since many Chinese customers only accept minimal void rates in their high-end productions. Ersa Equipment like the Reflow Soldering System HOTFLOW VOIDLESS 3/20 or the Hybrid Rework System HR 600/2 VOIDLESS easily cope with these challenging customer demands. According to the motto “Festival of Innovations” Ersa presented its repertoire in China and thus managed to acquire several projects. With its presence on both fairs SMT and Nepcon Ersa has successfully mastered two major fairs in one week.