As part of the LEAP Expo in Shenzhen, Kurtz Ersa Asia Ltd. organized a soldering competition in cooperation with Leap Organizer to create a program for soldering a circuit board. The competition focused on program speed, drum filling, PCB cleanliness and cycle time.
After the live broadcast of the soldering process, which was commented on by Ersa Team, an X-ray image was taken to determine the quality of the solder joint. An invited IPC expert then evaluated the PCB produced. Between the competitions, participating suppliers presented their products – in the form of presentations on flux, nitrogen and the X-ray process. At the end of each day of the fair, the individual results of the participants were presented on a big screen, followed by an awards ceremony. The competition and live presentation attracted many visitors, who said that the Ersa stand was by far the most attractive at the trade fair.