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At this year’s SMT Hybrid Packaging in Nuremberg, the most important international specialist fair for system integration in microelectronics, system supplier Ersa is once again presenting innovative highlights for electronics manufacturing under the motto DISCOVER SMART TECHNOLOGIES. Ersa developers and engineers have long raised their eyes from the individual product, setting their sights on optimum solutions for customer requirements or integration into digital systems. An extremely successful approach, which brought Ersa GmbH this year the award “world market leader in soldering systems (soft soldering)” from the University of St. Gallen.
Highest flexibility in selective soldering – Ersa VERSAFLEX
One of the absolute Ersa highlights for innovative and efficient solution approaches is the VERSAFLEX soldering module for the leading inline selective soldering platform VERSAFLOW 4/55. Two solder pots – installed independently on two axis systems and individually adjustable and controllable in x/y/z-direction – open up completely new and flexible dimensions in electronics manufacturing: whether completely independent soldering of PCBs or simultaneous soldering on multiple boards in x or y-direction, each combined with impressive cycle times. Today, the VERSAFLEX module is proving itself in real electronics manufacturing, confirming its pioneering technical position – for example at Siemens Austria or Kitron in Lithuania.
As intelligent addition, the intuitively controllable Ersa CAD Assistant 4 (available for SMARTFLOW 2020, ECOSELECT 4, VERSAFLOW 4/55 and 4 XL) provides fast offline programming with automatic cycle optimisation – in parallel with the production of the machine, for constant, highest-level machine availability. Developed especially for “big boards”, the VERSAFLOW 4 XL offers greatest versatility and highest soldering quality in PCB formats up to 610 x 1,200 mm.
Ersa Solutions: Oriented towards customer requirements
Ersa is also setting trends in the printer sector – with the VERSAPRINT 2, Ersa is presenting the next generation of its stencil printer. Intelligent features such as an integrated 3D-SPI (VERSAPRINT 2 Ultra3), a smart touch screen-user interface and “features on demand” are the basis for the highest cost effectiveness and flexibility. In the area of reflow soldering systems too, demand for longer machines which can deliver top temperature performance with low operating costs is rising – the answer from Ersa is: HOTFLOW 4/26. With the HR 600 XL, an almost fully-automated hybrid rework system for XXL boards of up to 625 x 625 mm, Ersa rounds off the rework portfolio which started with its entry-level appliance HR 200, moved up to HR 550, and then on to HR 600/2.
At SMT Hybrid Packaging 2018, Ersa is showing an attractive cross section of its extensive portfolio which perfectly illustrates its comprehensive process competence and permits the transfer of know-how in every direction. Not for the first time, Ersa GmbH is forgoing the physical presence of its high-performance soldering systems – the SMART TECHNOLOGIES are present in digital form, of course, and prove the ideal basis for discussions on all possible projects in the area of soldering. These dialogues will certainly be continued many times after this year´s SMT in the Ersa application centres – when it comes to verifying the desired results specifically in a real production environment and then implementing them at the production site. Customers around the globe rely on Ersa´s future-proof solutions available worldwide. Whatever the individual requirements for a specific electronics production are, the SMART TECHNOLOGIES from Ersa form the basis for intelligently integrated solutions.