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At this year’s SMT Hybrid Packaging in Nuremberg, the most important international specialist fair for system integration in microelectronics, system supplier Ersa is once again presenting innovative highlights for electronics manufacturing under the motto DISCOVER SMART TECHNOLOGIES. Ersa developers and engineers have long raised their eyes from the individual product, setting their sights on optimum solutions for customer requirements or integration into digital systems. A highly-successful approach which, at the beginning of the year, gained Ersa GmbH the “World market leader in soldering systems (soft soldering)” award from St. Gallen University.
Highest flexibility in selective soldering – Ersa VERSAFLEX
One of the absolute Ersa highlights for innovative and efficient solution approaches is the VERSAFLEX soldering module for the leading inline selective soldering platform VERSAFLOW 4/55. Two solder pots – installed independently on two axis systems and individually adjustable and controllable in x/y/z-direction – open up completely new and flexible dimensions in electronics manufacturing: whether completely independent soldering of PCBs or simultaneous soldering on multiple boards in x or y-direction, each combined with impressive cycle times. Today, the VERSAFLEX module is proving itself in real electronics manufacturing, confirming its pioneering technical position – for example at Siemens Austria or Kitron in Lithuania.
As an intelligent addition, the intuitively-controllable Ersa CAD Assistant 4 (available for SMARTFLOW 2020, ECOSELECT 4, VERSAFLOW 4/55 and 4 XL) provides fast offline programming with automatic cycle optimisation – in parallel with the production of the machine, for constant, highest-level machine availability. Developed especially for “big boards”, the VERSAFLOW 4 XL offers the greatest versatility and highest soldering quality in PCB formats up to 610 x 1,200 mm.
Ersa Solutions: Oriented towards customer requirements
Ersa is also setting trends in the printer sector – with the VERSAPRINT 2, Ersa is presenting the next generation of its stencil printer. Intelligent features such as an integrated 3D-SPI (VERSAPRINT 2 Ultra3), a smart touch screen-user interface and “features on demand” are the basis for the highest cost effectiveness and flexibility.
In the area of reflow soldering systems too, demand for longer machines which can deliver top temperature performance with low operating costs is rising – the answer from Ersa is: HOTFLOW 4/26. With the HR 600 XL, an almost fully-automated hybrid rework system for XXL boards of up to 625 x 625 mm, Ersa rounds off the rework portfolio which started with its entry-level appliance HR 200, moved up to HR 550, and then on to HR 600/2.
At SMT Hybrid Packaging, from 05 to 07.06.2018, Ersa is showing an attractive cross section of its extensive portfolio which perfectly illustrates its comprehensive process competence and permits the transfer of know-how in every direction. Not for the first time, Ersa GmbH is forgoing the physical presence of its high-performance soldering systems – the SMART TECHNOLOGIES are present in digital form, of course, and prove the ideal basis for discussions on all possible projects in the area of soldering. This dialogue is repeated time and again in the Ersa application centres – customers from all over the world specifically head there to verify the desired results in a real production environment. Customers around the globe know that the Ersa solutions and the associated services are available worldwide and build on a future-proof Industry 4.0 basis.
What are your requirements in electronics manufacturing? Take the time to visit the SMT; the Ersa Team looks forward to talking to you – from 05 to 07.06.2018 at SMT Hybrid Packaging in Nuremberg!