Wertheim/Verderio Superiore, 28.06.2018
Traditionally the two-day in-house seminar of Packtronic took place in their premises in Verderio Superiore north of Milan. Packtronic as one of the most important Ersa sales partners in Europe and Sales Manager Luca Fiorucci had come up with an extremely topical and hotly discussed topic for this event on 20 and 21 June: LMPA – Low Melting Point Alloy. More than 50 customers from large parts of Italy found this interesting and took part in two interesting and informative technology days. As always, the seminar was divided into two parts: In the morning, the topic was discussed and in the afternoon, live demonstrations were held at the Application Center using the real example.
In contrast to the solder alloy currently used, which is processed at 270–280 C°, 210–220 C° is sufficient for low-melting solder (LMPA) to solder the components. Since the thermal loads of components and LP are much lower at LMPA, the electronics market is naturally very interested in this solder. After presenting and teaching the technical basics of LMPA, the practical part was due for the visitors after lunch. For the live demonstration a VERSAFLOW 4/55 with double pots was installed, the two pots contained different solder – one SAC305, one LMPA from Interflux. The Interflux demo board was soldered, whereby the differences in soldering were clearly visible.
If the speed of the SAC solder could only be set to 10 mm/s, the LMPA solder could be soldered at a significantly higher speed of 40 mm/s. Decisive here: with the same result, with reduced preheating time. The stencil printer VERSAPRINT Ultra3 was also shown live. Equipped with integrated 3D inspection, it was printed with LMPA solder and the result was then evaluated. Both machines were carefully inspected, and in the end the visitors travelled home satisfied and with newly acquired knowledge. Packtronic Sales Manager Luca Fiorucci was also very satisfied with the overall course of the event and will once again be organising an in-house trade fair with a topical theme next year.