The starting signal for the trade fair and event year 2021 was given in mid-January in Japan: together with its local partner Dynatech Plus Corp., Ersa presented its comprehensive product range for soldering and solder paste printing at Nepcon Japan in Tokyo. The industry meeting point was dominated by the future topics of digitalization, such as 5G/6G, Internet of Things or power electronics.
The highlights at the Ersa and Dynatech Plus booth were the VERSAFLOW 4/55, the Ersa flagship from the selective soldering sector, as well as the HR 500 and HR 600/2 hybrid rework systems.
Overall, Nepcon Japan 2021 had a weaker attendance than in previous years, but this was to be expected due to the current health policy situation. However, thanks to the ingenious dual trade fair concept of our partner Dynatech Plus, the event can be considered a clear success for Ersa: Already one week before the start of the trade fair, customers and prospective customers could inform themselves in advance about the exhibits on display at a virtual in-house exhibition and take a closer look at them in live demos. During Nepcon, the company then met with customers in person for targeted hands-on sessions.
Dynatech Plus Corp. has been very successful for Ersa in the Japanese market for years. “The cooperation is characterized by continuous growth, which has recently further increased. Together with Dynatech Plus, we will continue on this growth path,” Rainer Krauss, General Sales Manager, summarizes the trade fair positively.