HR 550

Article No.: 0HR550
Visually leading: guided rework with high-performance optical system and flexible heating technology.

HR 550 Hybrid Rework System
HR 550 Hybrid Rework System
HR 550 vision box for component alignment
Adjusting a QFP - green = pad, red = pin, blue = overlay
HR 550 component placement


Ersa Rework - HR 550 product video

GUIDED REWORK – Ersa HR 550 Trailer


Flexible, high-performance Hybrid Rework System, 3,900 W

Guided Rework!

  • Highly efficient 1.500 W hybrid heating head
  • Large-area IR bottom heating in 3 heating zones (2.400 W)
  • Integrated vacuum pipette for component removal and placement
  • Highly accurate placement with integrated force sensor
  • Enhanced Visual Assistant (EVA)
  • Computer aided component placement
  • Process control and documentation via software HRSoft 2
  • Suitable for the use of the Dip&Print Station


To the Ersa BGA clips - watch them all now!

Questions about the product? Please find your personal contact here.

Technical Data

Dimensions (W x D x H) in mm
573 x 765 x 545/747 (heating head down/up)
Weight in kg
Antistatic Design (y/n)
Power Rating in W
Nominal voltage in V AC
Upper heating
Hybrid emitter (900 + 600 W), 70 x 70 mm
Lower heating
IR emitter (3 x 800 W), 390 x 270 mm
PCB size in mm
from 20 x 20 to 382 x 300 (+x)
Component size in mm
from 0.5 x 0.5 to 70 x 70
Windows PC
Test symbol


High precision repair process:

Desoldering, placement and soldering of all types of surface mounted devices (SMD) - up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.

BGA socket / BGA base
SMD Components
CSP Rework

Questions to your applications will be answered by our Ersa Experts.


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Temperature Sensor Cord

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Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

HR 550 Hybrid Rework System
HR 550 Hybrid Rework System

Article No.: 0HR550