HR 550 XL

Article No.: 0HR550XL
Large and flexible: guided rework for large boards up to 530 x 530 mm

Videos

REWORK Demo goes online!

Ersa explains #4.1 – BGA desoldering

Rework at highest level

Safe machining of large assemblies:

1,800 W high-performance hybrid heating element
Full-surface 6,400 W IR bottom heater
High-resolution cameras for placement and process monitoring
Computer-aided component alignment, digital split optics
Ergonomically optimal system operation
Modern, user-friendly operating software

Technical Data

Dimensions (W x D x H) in mm

755 x 930 x 545/747

Weight in kg

102 kg including control unit

Antistatic Design (y/n)

yes

Power Rating in W

8,200

Nominal voltage in V AC

3x 400 VAC, 50-60 Hz, 16 A

Upper heating

Hybrid radiator 900 W infrared + 900 W hot air, 70 x 70 mm

Lower heating

IR emitter (8 x 800 W), 530 x 530 mm

Measuring channels

3x K-type, 1 x IRS

Position laser

Class II

PCB size in mm

up to 530 x 610 mm (+x)

Component size in mm

from 01005 up to 70 x 70 mm

Working depth

349 mm

Usable working distance (typ.)

30-60 mm to top heater, 35 mm to bottom heater

Placement camera, upper

5 MP GigE colour camera, 70 x 70 mm (wide angle), 25 x 33 mm (telephoto)

Compressed air connection

6-10 bar (oil-free), ¼ inch quick coupling

Volume of air cooling

approx. 65 l/min (@ 6 bar)

Test symbol

Operating software

HRSoft 2 - suitable for Windows 8 and Windows 10

Option

Reflow process camera: 10 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable; component rotation and x/y adjustment motorized, tip operation with resolution less than 20 µm

Application

High precision repair process:

Desoldering, placement and soldering of all types of surface mounted devices (SMD) - up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.