IR 550
Article No.: 0IR550A
Highly flexible IR Rework System with precise component placement
Worldwide, thousands of customers
trust the Ersa IR 550 rework system!
- 800 W heating head with aperture system
- Homogeneous 800 W IR bottom heating
- Medium wavelength Infrared spectrum for balanced, soft heating
- Integrated "DIGITAL 2000 A" solder station
for rework and removal of residual solder - Closed temperature control circuit with thermocouple or non-contact sensor
- Intuitive operation with or without PC connection
- Process control and documentation via the operator software IRSoft
- Suitable for the use of the Dip&Print Station
The IR 550 rework system is available as a stand-alone version only.
The placement system PL 550 was discontinued in 12/2019.
Alternative products: HR 600, HR 550, HR 500.
Questions about the product? Please find your personal contact here.
Technical Data
Application
Flexible assembly unit repair
All types of SMD of 1 x 1 up to 40 x 40 mm can be processed. Flexible desoldering, placement and soldering of surface mounted devices (SMD), e.g. chips up to 0402, SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; plastic BGA components are a typical rework application for the IR 550 system; for QFP components an optional split optics cassette is available.
As nozzles are not required, even special components like shielding plates or plugs can be processed very well.
Questions to your applications will be answered by our Ersa Experts.
Options
Ersa recommends the following accessories:
for Ersa IR/PL 500 and IR/PL 650
Article No.: 0IR6500-17
Article No.: 0IR6500-17
Additional PCB Holder
for Ersa IR/PL 500 and IR/PL 650
Additional PCB Holder for asymmetric printer circuit boards.
Article No.: 0PH360
Board Holder
Intake and support of bigger boards, maximum size approx. 270 x 365 mm.
for AccuTC thermocouple
Article No.: 0IR5500-35
Article No.: 0IR5500-35
Flexpoint TC Holder
for AccuTC thermocouple
Flexible and steady adjustment of the thermocouple at the solder joint; suitable for AccuTC thermocouples.
Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm
Article No.: 0IR5500-40 + 0IR4520-07
Article No.: 0IR5500-40 + 0IR4520-07
Micro-Pickup Type 0510
Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm
The all-metal micro-nozzle 0IR5500-40 has an outer diameter of 0.9 mm and an inner diameter of 0.5 mm. It can be directly used for lift-off of small chip components and similar.
In case of a component has high adhesion force by large area bottom connections, the 1 mm silicone suction cup 0IR4520-07 can be used with the nozzle. The improved sealing creates a higher vacuum force during lift-off.
Additional products
More accessory you will find in the Ersa Shop.
Available Versions
The following product versions or modules are available:
Article No.: 0IR550A
IR 550 Rework System
- Medium IR technology for homogenous heating and low differences in temperature
- Patented aperture system at IR upper emitter replaces expensive, component specific nozzles
- Integrated vacuum pipette for removal of components
- No blowing away of little components, because no use of hot air
- Measurement of temperature with thermocouple or non-contact IR sensor directly at the component
Camera with 70x magnification
Reflow process camera RPC 500
Camera with 70x magnification
- High-quality CMOS USB 2.0 camera for optical control during rework
- 70x optical macro zoom lens
- LED dual spot luminaires with flexible arms and adjustable luminosity