IR 550

Article No.: 0IR550A
Highly flexible IR Rework System with precise component placement

IR 550 Rework System (0IR550A)

Videos

Ersa explains #4.1 – BGA desoldering

Ersa explains #4.2 – BGA pad preparation

Worldwide, thousands of customers
trust the Ersa IR 550 rework system!

IR 550 with an 800 W heating head with aperture system
Homogeneous 800 W IR bottom heating
Integrated "DIGITAL 2000 A" solder station
for rework and removal of residual solder
Closed temperature control circuit with thermocouple or non-contact sensor
Intuitive operation with or without PC connection
Process control and documentation via the operator software IRSoft
Suitable for the use of the Dip&Print Station

PL 550 discontinued from December 2019. Alternative products: HR 600, HR 550 and a shortly upcoming product. The IR 550 rework system will be continued as a stand-alone version.

Questions about the product? Please find your personal contact here.

Technical Data

IR 550 Rework System

Dimensions (W x D x H) in mm

300 x 380 x 315

Weight in kg

9.75

Antistatic Design (y/n)

Power Rating in W

1,600

Nominal voltage in V AC

230

Upper heating

IR emitter 800 W

Lower heating

IR emitter 2 x 400 W

PCB size in mm

from 20 x 20 to ~ 300 x 340

Component size in mm

1 x 1 to 60 x 60

Operation

Keyboard or Windows PC

Test symbol

CE, VDE

Application

Flexible assembly unit repair

All types of SMD of 1 x 1 up to 40 x 40 mm can be processed. Flexible desoldering, placement and soldering of surface mounted devices (SMD), e.g. chips up to 0402, SOIC, MLF, CSP, µBGA, BGA, QFP, PLCC; plastic BGA components are a typical rework application for the IR 550 system; for QFP components an optional split optics cassette is available.

As nozzles are not required, even special components like shielding plates or plugs can be processed very well.