Small Selective Soldering System with outstanding technology.

Ersa ECOSELECT 1 - close-up
Ersa ECOSELECT 1 - close-up

Highlights Selective Soldering System Ersa ECOSELECT 1

  • Compact Batch-type system with small footprint
  • Ersa CAD Software
  • Up to 2 solder bath to increase throughput
  • Use of mini-wave, mini-dip wave and area-soldering nozzle possible
  • Maintenance free electromagnetic solder pump drive
  • Drop-jet fluxer with integrated monitoring
  • High positioning accuracy and process safety
  • Lower, full-area IR preheater (scalable)
  • Convection top side
  • Low energy and N2 consumption






Optimal for manufacturing environments using cell production


With the ECOSELECT 1, Ersa expands its model range by a system which optimally fits, because of its small footprint of less than 3 m², into a manufacturing environment that is based on cell production. The semi-automatic ECESELECT 1 operates in all process steps with the proven Ersa selective soldering technology, just like the larger Ersa VERSAFLOW models, suffering no compromise in regards to quality and accuracy. The universal pallet mount allows processing boards with the size of up to 424 x 508 mm (optionally available 508 x 508 mm). The fluxer performs with the highest positioning accuracy and with the least amount of flux deposition.


Features such as spray jet monitoring, or the continuous pressure monitoring of the flux supply tank, ensure the presence of the proverbial Ersa process safety. Like the VERSAFLOW model range, the ECOSELECT 1 is equipped with a full area preheater cassette. The lower heater is furnished with 8 emitters, which can be switched in groups so that the power consumed can be adapted to the heat demand and the size of the board. The upper convection heater of the ECOSELECT 1 is optimally matched with the lower preheater, ensuring an effective and reproducible soak of even demanding board assemblies (multi-layer, heavy mass), with the energy being equally distributed across the complete board.

Innovative Dual Pot System

As are the large VERSAFLOW systems, the solder module of the ECOSELECT 1 comes also with electromagnetic pump installed, so that the bath is extremely low on maintenance. The pump ensures a very constant flow rate of solder and delivers therefore an exact and finely adjustable wave height. Dynamic process parameters such as solder level in the bath, solder wave height and solder temperature are continuously monitored and documented. With the innovative "peel off" feature, defects such as bridging when soldering at the 0° level are definitely no issue. The dual pot system allows that two different alloys are being used in the process. Extensive downtimes of the system due to pot change are thereby eliminated. Alternatively, the dual pot system can also be used for running the solder process with two different sized nozzles. The ECOSELECT is operated via PC controls with ERSAsoft. The process writer, which continuously records the actual values of all aggregates relevant to the soldering process, and the solder protocol, which stores the process data with all info required for traceability as per ZVEI standard, are part of the standard system specification.

Also a standard feature is the encompassing alarm management. All notifications are stored showing a time stamp and the user identification. All data is available in the XML format, and can therefore be easily worked on. With the help of the CAD assistant, DFX data of printed circuit boards can be used to create solder programs. As an alternative, picture of scanned-in boards can also be employed. All movements which the tables of the fluxer or the solder bath should be executing are graphically entered on the picture of the board, and followed by entering the process data. The program thus created can immediately be used on the ECOSELECT 1.


  • Universal-pallet mount for boards of up to 508 x 505 mm
  • Lower preheater with short-wave, dynamic IR emitters
  • Maximum permissible board weigth: 12 kg
  • Convection heater top side
  • Second solder bath to process two different alloys
  • Second solder bath to process multi-up panels
  • Camera/Monitor to view the solder process
  • Barcode-Scanner (bar code/2D)
  • Acquisition of board data from CAD systems (CAD Assistant)
  • Touch operation
  • Fiducial recognition

Techn. Data


  • Length from 1,700 mm
  • Width approx. 1,500 mm
  • Height approx. 1,612 mm

Conveyour support

  • Universal pallet mount
  • PCB width: 15-406 mm (optional 508 mm)
  • PCB length: 15–508 mm
  • Maximum PCB top side clearance: 120 mm
  • Maximumg PCB bottom side clearance: 60 mm (30 mm upto z – variable)
  • Maximum PCB weight: 8 kg (option 12 kg)

Media supply

  • Nitrogen
  • Pneumatic system
  • Electric supply
  • Extracted air

Flux module

Drop-Jet in different sizes

Preheat module

  • IR heating, convection or combination of IR and convection

Solder module

  • Electromagnetic solder pot
  • Mini-wave 13 kg up to 2 pots



Questions about the product?
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Your contact persons for the process
Product Management Ersa Soldering Systems Germany