In- and off-line cell concept for selective soldering with best price and performance ratio.

Selective Soldering System Ersa ECOSELECT 2
Selective Soldering System Ersa ECOSELECT 2
Ersa ECOSELECT 2 - process tunnel
Ersa ECOSELECT 2 - nozzle camera


Ersa ECOSELECT 2 - flexible solution for modular production line


Highlights Selective Soldering System Ersa ECOSELECT 2

  • Compact Selective Soldering System with small footprint
  • Batch or in-line operation
  • Ersa CAD Software
  • Up to 2 solder bath and 2 fluxer heads to increase throughput
  • Use of mini-wave nozzles, mini-dip nozzles and area-soldering nozzles possible
  • Maintenance free electromagnetic solder pump drive
  • Drop-jet fluxer with integrated monitoring
  • High positioning accuracy and process safety
  • Lower, full-area IR preheater (scalable)
  • Convection top side
  • Low energy and N2 consumption




Flexible solution for modular manufacturing concepts


Ersa, the worldwide technology leader in selective soldering systems, complements with the ECOSELECT 2 the successful VERSAFLOW line of systems with a compact selective soldering unit. This system is the optimal solution for processing small to medium production runs, where flexibility is of prime importance. The intelligent and clearly laid out user software, which also records all relevant production parameters, allows for simple and effective programming of the system. One highlight is offered by the graphical programming interface vie the CAD Assistant 2 – this new software version makes offline programming, with the system in continuing operation, easily and very quickly possible.


Programmable precision spray fluxer for flux deposition

DFX data scanned-in printed circuit boards can be used for programming. The user administration function rules out the unauthorized use of the system. Like all Ersa selective soldering systems, the ECOSELECT 2 features a programmable precision spray fluxer with integrated spray jet monitoring to deposit flux either in points or in tracks. The extremely precise flux deposition ensures minimal flux use and offers therefore the highest level of cleanliness of the assemblies. Short-wave IR emitters on the underside of the board speed up the preheat process. Individual segments of the heater cassette can be, based on the product, switched off. With the optional upper convection preheater, a homogeneous soak of even the most complex assemblies can be ensured.


At the heart of the system is the solder process itself: The "peel off" effect developed by Ersa for soldering at a 0° angle eliminates the risk of bridging and ensures achieving the lowest DPM rate. The solder bath requires very little service and is free of wear parts. Innovative monitoring systems ensure the reproducibility of the process parameters. The new inn- and offline concept of the ECEOSELECT 2 offers the quality of the selective soldering process at the best price/performance ratio. Thus it is, both for, users new to the process as well as for those producing in series, the perfect and flexible solution.

Technical Data


  • Length from 2,300 mm
  • Width approx. 1,730 mm
  • Height approx. 1,650 mm

Conveyor system

  • Pin-and-chain conveyor
  • PCB width: 63.5-508 mm
  • PCB length: 127-508 mm
  • Maximum PCB top side clearance: 120 mm
  • Maximumg PCB bottom side clearance: 60 mm (30 mm upto z – variable)
  • Maximum PCB weight: 8 kg (option 12 kg)

Media supply

  • Nitrogen
  • Pneumatic system
  • Electric supply
  • Extracted air

Flux module

  • Drop-Jet in different sizes

Preheat module

  • IR heating, convection or combination of IR and convection

Solder module

  • Electromagnetic solder pot
  • Mini-wave 13 kg up to 2 pots


  • Pin-chain conveyor for direct board handling
  • Programmable width adjustment
  • Precision drop-jet fluxer
  • Maximum permissible board weight: 12 kg
  • Infeed/Exit module
  • Lower preheater, short-wave, dynamic IR emitters
  • Electromagnetic mini-wave solder bath
  • Second solder bath for the use of different alloy or, alternatively, for processing multiple-up panels
  • Take-over from PCB data from CAD system
  • Touch operation