Inline and batch selective soldering system for highest selective quality.



Ersa ECOSELECT 4 product video


Highlights Selective Soldering System Ersa ECOSELECT 4

  • Flexibly integrable soldering system: inline or batch operation
  • VERSAFLOW 4 technology
  • PCB size 508 x 508 mm
  • Roller conveyor
  • Up to two spray heads and flux tanks
  • Powerconvection
  • y/z variable dual solder pots
  • Automatic nozzle activation
  • Upgrade with independent flux module to a full inline machine
  • Award-winning ERSASOFT 5 software
  • VERSACAM – solder wave height measurement “on the fly”



The ECOSELECT 4 is Ersa’s newest selective soldering system. It is a compact system that is perfectly suited for small up to medium-sized batches where flexibility is essential. The ECOSELECT 4 features machine technology of the latest VERSAFLOW generation. Its conveyor system is a high-quality roller conveyor for a max. PCB size of 508 x 508 mm. The ECOSELECT 4 can be used inline or in batch operation. Another machine highlight is the new power convection heating, for example, which provides an optimal and homogenous warm-up also of complex boards. Like all Ersa selective soldering systems the ECOSELECT 4 is equipped with a programmable precision spray fluxer with integrated spray control for precise and economical flux application in single spots or in tracks. A second spray head is available as an option.

Innovative machine operation with ERSASOFT 5
The new dual solder pot system of the VERSAFLOW 4 is also available for the ECOSELECT 4. Both mini wave pots can be moved flexibly in Y/Z direction. Thus, the machine operator can install solder nozzles with different diameters in order to quickly solder connectors using a nozzle with large diameter and using a very slim nozzle shape for joints which are difficult to reach. The innovative and user-friendly ERSASOFT 5 software renders machine operation even more intuitive. Through individual user interfaces, each group of operators receives, at one glance, the data and information it requires. A further software highlight is the PiP technology (picture in picture) combined with a process monitoring camera.


  • Roller conveyor
  • Programmable width adjustment
  • Precision drop-jet fluxer
  • Maximum permissible board weight: 15 kg
  • In-/Outfeed module
  • IR preheater individually configurable (bottom side)
  • Powerconvection
  • Electromagnetic mini wave solder pot
  • Y/Z variable dual solder pots
  • Second solder pot for different solder alloy
  • Transfer of board data from the CAD system
  • ERSASOFT 5 incl. integration of MES (Manufacturing Execution System)

Techn. Data


  • Length from 2,000 mm
  • Width approx. 1,800 mm
  • Height approx. 1,700 mm

Conveyor system

  • Roller conveyor
  • PCB width: 50-508 mm
  • PCB length: 127-508 mm
  • Maximum PCB top side clearance: 120 mm
  • Maximumg PCB bottom side clearance: 60 mm
  • Maximum PCB weight: 15 kg

Media supply

  • Nitrogen
  • Pneumatic system
  • Electric supply
  • Extracted air

Flux module

  • Drop-Jet in different sizes

Preheat module

  • IR heating, convection (option), powerconvection (option)

Solder module

  • Electromagnetic solder pot
  • Mini-wave 13 kg up to 2 pots



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Your contact persons for the process
Product Management Ersa Soldering Systems Germany