Solder wire L-Sn96,5Ag3,0Cu0,5

3,5 % flux core, halogen free
melting point 217 °C

   
 
 

Solder wire L-Sn96,5Ag3,0Cu0,5

 

DIN EN 29454 art. 1, type 1.1.3B or DIN EN 61190 -1-3 ROL0 3.5 % flux core, halogen-free.

Melting point 217 °C

 

Low-residue, halogen-free No-Clean solder wire. Especially adapted to the requirements in electronics production. The flux stands out by hight temperature resistance, and it does not spray while melting. The light, solid flux residues are neither corrosive nor electrically conductive. Consequently it is not necessary to remove them from the solder joint.

 

 

Technical Data

Flux make (y/n)
y

Design

Article number

weigth in Kg

wire diameter

005MM0100LF02 0,100 0,5 mm
010MM0250LF02 0,250 1,0 mm
015MM0250LF02 0,250 1,5 mm
010MM0500LF02 0,500 1,0 mm

Accessories