Solder wire L-Sn99,3CuNiGe

3,5 % flux core, halogen free
melting point 217 °C

   
 
 

solder wire L-Sn99,3CuNiGe

 

DIN EN 29454 art. 1, type 1.1.3B or DIN EN 61190 -1-3 ROL0 3.5 % flux core, halogen-free.

Melting point 217 °C

Low-residue, halogen-free No-Clean solder wire. Especially adapted to the requirements in electronics production.

 

 

Technical Data

Flux make (y/n)
y

Design

Article number

weigth in Kg

wire diameter

003MM0100LF20 0,100 0,35 mm
005MM0100LF20 0,100 0,5 mm
007MM0250LF20 0,250 0,7 mm
010MM0250LF20 0,250 1,0 mm
015MM0500LF20 0,500 1,5 mm

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