Chip bonding

This term refers to the method used during the manufacture of chips of how to mount the bare die (fragment of the waver) on to the base plate. To fix the bare die to the base plate, a few methods are in use: gluing with epoxy or silicon resin, glass soldering and soft soldering, and eutectic soldering (ultrasonic).

Weitere Begriffe

Cooling gradient, Coefficient of expansion, Component, Crack, CAD, CAF, CAM, CEM basic material , Chemical silver, Chemical tin, Chip, Chip component, Chip carrier, Chip on board, Chloride, Coffin Manson, Computer controlled soldering systems , Conformal coating, Connected solder balls, Crack
 
 
 
 
 
 
 
 
 
 
 
 
 
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