In solder paste printing, a distinction is made between open print and enclosed print heads. In the open print process, the solder paste rests on the stencil and is pulled across the stencil by a squeegee. N the case of enclosed print heads, the solder past is held in an enclosed reservoir. This space is, on its lower side and directed towards the stencil, open, with the long sides of the print head being sealed to the stencil by wiper blades. The solder paste in the reservoir is pressurized, thereby pushing it into the stencil apertures. The wiper blades accurately peel the paste of the stencil surface. Since the pressure is vertical from top down, enclosed print heads are very suitable for the pin-in-paste process.