In this selective soldering process, an inductively heated, temperature controlled thermode in the shape of the joint to be formed is placed from the top on the leads of the component to be joined. The temperature of the stamp transfers sufficient temperature to melt the solder. Pressure is supplied throughout the whole process, to prevent components to move during the cool down. The heating element is heated and cooled for each connection. Solder is found on the pad already in the form of remelted solder depots. Only a small amount of flux needs to be added.