Manual placement

Components are being placed manually if, either because of small volume requirements or because of the geometry of the components, automated placement is not possible.

Weitere Begriffe

Miss print, Microstructure, Main Solder Wave , Magnesium, Manhattan Effect, Multiple Soldering Processes, Multilayer Board, MELF Components, Meniscus, Measuring Board, Metal Content, Metallization, Metal-Core Substrate, Metal Stencil, Microvias, Miniwave Soldering, MID, Migration, Multi-Chip Module, Multilayer
 
 
 
 
 
 
 
 
 
 
 
 
 
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