An eutectic alloy solidifies respectively melts completely at a precisely defined temperature. Non-eutectic alloys, on the other hand, solidify or melt in a temperature range. In this range, the alloy is pasty, since one element of the alloy is in the process of separating out of the melt. In the electronic industry, preferably eutectic alloys are being used, since eutectic alloys usually has the lowest melting point of the alloying compound. This being the case, the assembly to be soldered has the least exposure to elevated temperatures.