In the plasma soldering process, the surfaces of the parts to be soldered are freed of interfering oxides with the help of plasma. This process has been used in wave- as well as in reflow soldering in order to be able to eliminate the requirement for fluxing. The mechanical effort to build and operate the systems was enormous, the throughput was low and the associated costs rather high. In addition, doubts existed whether the plasma treatment might damage the components on the assembly, doubts, which could never completely be relieved. For these reasons, this very innovative process could not get a foothold on the market.