A temperature profile measurement, taken during a soldering process, serves to establish the relationship between changes in temperature in dependence of lapsing time. For data acquisition, measuring systems are used which pass, together with a measuring board, through the process. The data logged is displayed in graphic form on a PC display, and can then be evaluated. In dependence of the measuring task, either specially prepared assemblies are used, or special measuring boards with thermocouples mounted. Either temperatures of actual SMT components can be measured or a length profile (contact time of the wave) or a cross profile (flatness of the wave) can be generated. These temperature measurements are very important, as they can show whether the process as set is thermally acceptable and safe for the product. In addition, process stability can be monitored and assured.