Ultrasonic microscopy allows generating images from the inside of an object. In the field of electronics, this is frequently used in the failure analysis of molded semiconductor components. In this way, the inside of an IC can be represented, and material detachment, cracks or voids can be made visible. The frequency of ultrasonic microscopy lies between 5MHz and 500MHz. The principle rests on measuring the elapsed time and the absorption of ultrasonic impulses, which occur when the impulses pass through the object being examined.