The principle of vapor phase soldering rests on the fact that with condensed vapor thermal energy can be transferred. In the electronic industry, this principle is being used to transfer thermal energy to PCB assemblies, soldering them in a reflow-type process. On the medium, the vapor, special demands are placed. It may not lead to any corrosion, not be electrically conductive, and it needs to allow high vapor temperatures without any associated high pressure. Fluorocarbon liquids fulfill these requirements. Contrary to normal convection (carrier medium gas), heat can be transferred to the assembly to be soldered much quicker – up to a factor of 10. The vapor phase process is also referred to as condensation soldering.