X-ray inspection of an electronic board assembly allows the non-destructive examination of visually not accessible solder joints and the insides of components. The x-ray beam radiates through the assembly, and variations in the density of materials lead to different level of weaknesses of the radiation. This results in a gray-scale image on the detector. Modern x-ray systems allow tomographic images, so that a realistic three-dimensional image of the inspected location can be generated. These images can be randomly sliced and viewed under various different angles.