Printing and 100% post print inspection at line speed.

Stencil Printer Ersa VERSAPRINT S1
Stencil Printer Ersa VERSAPRINT S1
Stencil Printer Ersa VERSAPRINT S1 - view to the inner life

Highlights Stencil Printer VERSAPRINT S1-2D

  • Superior Print and SPI Technology for inline production
  • Very fast 100% solder paste inspection (SPI) through parallel processing of print and inspection cycle
  • Very fast set-up through line scan camera
  • Simplest operation and user interface as per SEMI-Standard
  • Closed-loop squeegee head
  • Automatic cleaning of underside of stencil
  • Flexible stencil mount up to 740 mm
  • Options and required features can be easily configured and retrofitted
  • Print format up to 700 x 500 mm
  • Closed-loop function to the downstream 3D SPI

Technical Data

Substrate size (X x Y)
  • min. 50 x 50 mm
  • max. 550 x 500 mm
  • optional 700 x 500 mm
Substrate thickness 0,5-6 mm
Component clearance 0-30 mm
Stencil size
  • min. 450 x 450 mm
  • max. 737 x 737 mm
    both adjustable without adaptor
Print head Two independent print heads with continuous squeegee control force and the squeegee depth 
Squeegee force 0-200 N
Camera 2 line scan cameras to align and inspect substrate and stencil
Accuracy of repeatability 12,5 µm @ 6 Sigma
Print accuracy 25 µm @ 6 Sigma
Cycle time Less than 12 s + print
Board size (220 x 160 mm) Less than 30 s incl. print und 100% inspection
Time to set-up Less than 10 min
Product changeover Less than 2 min
Graphical User Interface
(width x heigth x depth)
SEMI-Standard E95-1101 
(1.185 x 1.770 x 1.600 mm)


Configuration of the basic system

  • Patented Line-Scan-Technology (LIST) for substrate orientation and inspection
  • Simplest program generation through full-area scanning of the substrate
  • Processing of large substrates - 550 x 500 mm
  • Recognition of synthetic fiducial marks or random geometries
  • Diffuse and direct camera illumination for optimal recognition and orientation of the substrate
  • Two independent, free-floating print heads
  • Programmable print head with closed control system
  • Pneumatic Clamping of the squeegee prevents loosening during production
  • Substrate fixation through over-top and y-clamping, auch verwobene substrate are clamped securely
  • Motorized conveyor width adjustment, programmable via software, standard is front rail fixed
  • Conveyor direction freely selectable, standard is left-right, left-left, optional: right-left, right-right
  • Flexible stencil mount for different sizes, no adapter required
  • Substrate support through magnetic pins and magnetic blocks
  • Windows 7, 19"-TFT-Monitor; system programs and SPC-Data can be administered in the network
  • SPC-Data is graphically displayed for the viewer and stored on the hard disc

AOI - Automatical Optical Inspection

  • Integrated post-pint control with LIST
  • Very simple programming of the area to be inspected through the overview images of the substrate on the monitor
  • Definition of areas with different sensitivity settings
  • Post print control of the substrate for printing on the pads and for bridging between pads
  • Inspection of the stencil for clogging of the openings and for smearing
  • Display of the errors on the monitor for easy verification through the operator
  • Automatic cleaning cycle after errors found during stencil inspection
  • Speed of the inspection: 9.100 mm²/s (Width: 260 x 35 mm/s)
  • SPC-Data acquisition

Stencil cleaner

  • Stencil underside cleaning with controlled motorized paper advance
  • Modes "Dry", "Wet" and "Vacuum" freely programmable
  • Wetting of the cleaning paper through a movable dispenser with adjustable flow volume - and speed control
  • Vacuum strip in different length available: 250 / 380 / 500 / 560 mm


The VERSAPRINT S1-2D is an inline stencil printer which distinguishes itself through its simple operation and its simple structure. It is of modular design and can, depending on the applications, be configured as required. The highlight of this printer is the integrated 100% print inspection feature, which is performed in parallel to the printing process.


  • Dispenser for print media on the stencil
  • Dispenser for glue or solder paste on the substrate 
  • Solder paste height control - stencil
  • Retractable over-top clamping
  • Temperature control
  • Data-Matrix-Code recognition - upper and lower side
  • Set-up verification
  • Support systems: VarioGrid, GridLok and Quik-Tool
  • 700 mm Stencil cleaner, lower side
  • Closed-loop printer - 3D-SPI