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The newly developed nozzle geometry reduces solder spatter by up to 18% when multi-wave soldering a particularly complex application. The picture shows the nozzle plate with different sized nozzles and drain chutes
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  • Ersa Wave Soldering: Reduce solder splashes with adapted nozzle geometry
Ersa

Ersa Wave Soldering: Reduce solder splashes with adapted nozzle geometry

07.11.2024

Wertheim | Together with the international automotive supplier FORVIA HELLA, Ersa GmbH has developed a new nozzle geometry that is used for multi-wave soldering in nozzle plates. The advantage of the new geometry is that the occurrence of solder spatter can be reduced by up to 18%. Prior to these newly developed multi-wave insert nozzles, nozzles with a straight surface were used throughout, with which it was not possible to control the solder during flow.

How did the new development come about? In November 2023, FORVIA HELLA and Ersa began equipping the multi-shaft insert nozzles with a guide for a particularly complex application – this serves as a chute to ensure targeted solder flow. The angle of the guide is variable between 30° and 60° and is adapted to the respective application. Ultimately, this depends on the solder flow running vertically through the solder nozzles.

The new guide reduces the drop height of the solder, which significantly reduces the number of solder splashes. “Thanks to this design adaptation, we have found new ways to significantly improve the soldering quality on the customer side. This is a highly complex application that we developed in close cooperation with our customer. I would like to take this opportunity to thank the FORVIA HELLA team for the great cooperation and the literally constructive partnership,” says Ersa´s General Sales Manager Rainer Krauss, who is always open to individual process optimizations.

The newly developed nozzle geometry reduces solder spatter by up to 18% when multi-wave soldering a particularly complex application. The picture shows the nozzle plate with different sized nozzles and drain chutes
The newly developed nozzle geometry reduces solder spatter by up to 18% when multi-wave soldering a particularly complex application. The picture shows the nozzle plate with different sized nozzles and drain chutes
Adapted multi-wave insert nozzles for wave soldering (left) and in section (right)
Adapted multi-wave insert nozzles for wave soldering (left) and in section (right)
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