Ersa Reflow soldering

HOTFLOW 3: Reflow system for maximum flexibility

The HOTFLOW 3 uses patented Ersa heating technology for optimum heat transfer with minimal energy and nitrogen consumption. In terms of productivity to footprint ratio, the Ersa reflow soldering system sets the industry standard.

Double to quadruple transport options enable amazing throughput increases without additional floor space. With up to four transport speeds, precisely adjusted transport widths, a wide variety of assemblies can be processed on the system.

Technology Highlights

  • Best temperature transmission for a wide variety of flat modules
  • Residual oxygen control with low N2 consumption
  • Low energy consumption through intelligent energy management
  • Multistage controlled cooling
  • Multi-stage process gas cleaning system
  • "On the fly" maintenance for increased machine availability
  • Multitrack transport systems
  • Ersa Process Control (EPC) for continuous process monitoring
  • Ersa Autoprofiler software for instant temperature profile finding
 
HOTFLOW 3: Optimierter Reflow-Prozesstunnel: Prozessstabilität unter allen Auslastungssituationen
HOTFLOW 3: Leistungsstarke Kühltechnologie - aktive Kühlung für eine optimale Weiterverarbeitungstemperatur
HOTFLOW 3: Maintenance-on-the-Fly: höchste Maschinenverfügbarkeit durch größte Servicefreundlichkeit
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