Inspection

ERSASCOPE M plus XL

Inspection systems for fast inspection of hidden solder joints on large printed circuit boards

Article No.: 0VSSC080PX

Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.

Specifications
Ersa inspection systems

ERSASCOPE tripod

  • Dimensions (WxDxH) in mm: 500 x 520 x 400
  • Weight in kg: 5
  • Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics
  • Version antistatic (y/n): yes
  • Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB)

ERSASCOPE - optical solder joint inspection

Uniquely efficient: optical inspection of solder joints with Ersa's patented systems - the ideal complement to X-ray inspection of BGAs!