Optical inspection with Ersa ERSASCOPE M plus XL

Inspection systems for fast inspection of hidden solder joints on large printed circuit boards

Article No.: 0VSSC080PX

Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.

Technology Highlights

Inspection system with two quick-change objectives:
- 90° BGA optics (approx. 280 µm gap)
- 0° macro zoom inspection optics
Fast inspection of hidden solder joints
Integrated, dimmable LED illumination
N-MOS color camera 5 megapixel, with USB connection
Additional LED fiber light or LED light source with gooseneck and light fan
Ideal for stationary inspection
Ersa ImageDoc v3 inspection software (basic version) included

Application: Inspection of hidden solder joints and more

High flexibility and speed with handheld inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.

Specifications
Ersa Inspection Systems

ERSASCOPE tripod

Dimensions (WxDxH) in mm: 500 x 520 x 400
Weight in kg: 5
Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics
Version antistatic (y/n): yes
Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB)

Ersa MOBILE SCOPE basic unit

Dimensions (LxWxH) in mm: 114 x 36 x 51 (without supply cable)
Weight in g: 210
Principle: integrated optical system with built-in camera and LED light source
Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics)
Light control: potentiometer (0-100%)
Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment
Focus adjustment: integrated focus ring on optics
Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics

Interchangeable optics 90° BGA module

Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90°
Application: Inspection of hidden solder joints with gap dimensions from 50 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm: 83
Weight in g: 60
Magnification: up to 15x - 180x (on 14" monitor)
Footprint: 8.2 x 0.8 mm
Focus range: 0.5-30 mm

80x MACROZOOM lens with LED

Design: integrated zoom optics, built-in dimmable LED illumination, distance pin with three distance levels
Application: fast, flexible supervisory inspection at high magnification
Total length in mm: 43 (with telecopic support max. 85)
Weight in g: 35
Magnification: 8x - 80x (14" monitor)
Focus range: 5-200 mm

Inspection camera

Design: 1/3" N-MOS solid-state color image sensor, permanently integrated in MOBILE SCOPE base unit
Mark of conformity: CE
Version antistatic (y/n): yes

Inspection table

Design: X/Y table with fine adjustment, rotatable, ball bearing mounted, aluminum, with four additional support feet
Dimensions (WxH) in mm: diameter 320 x 80
Travel range: 80 mm in X and Y direction, 360° rotatable with 90° detent option
Weight in kg: 5
Antistatic version (y/n): yes

ERSASCOPE - optical solder joint inspection

Uniquely efficient: optical inspection of solder joints with Ersa's patented systems - the ideal complement to X-ray inspection of BGAs!

Optical inspection system ERSASCOPE M plus XL

Inspection systems for fast inspection of hidden solder joints on large printed circuit boards

Technology Highlights

Application: Inspection of hidden solder joints and more