Article No.: 0VSSC080PX
Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints.
High flexibility and speed with handheld inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.
Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90°
Application: Inspection of hidden solder joints with gap dimensions from 50 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm: 83
Weight in g: 60
Magnification: up to 15x - 180x (on 14" monitor)
Footprint: 8.2 x 0.8 mm
Focus range: 0.5-30 mm
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