HR 600/2
Article No.: 0HR600/2
Hybrid Rework System - automatic desoldering, placement and soldering of SMT components
New definition of board repair -
automatic, flexible and process reliable!
- Highly efficient 800 W hybrid heating head
- Homogeneous, large-area IR bottom heating with 3 heating zones (800 W each)
- Automatic and precise component alignment with the help of machine vision
- Highly accurate, motor-driven axis system
for component placement (+/- 0.025 mm) - User independent, reproducible repair results guaranteed
- Process control and documentation via the operator software HRSoft
- Fully automatic or semiautomatic operation
- Suitable for the use of the Dip&Print Station
- Version HR 600/2 VOIDLESS upon request!
To the Ersa BGA clips - watch them all now!
Questions about the product? Please find your personal contact here.
Technical Data
Application
Automatic repair process:
Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of up to 1 x 1 mm.
Questions to your applications will be answered by our Ersa Experts.
Options
Ersa recommends the following accessories:
for observation of the soldering process
Article No.: 0HR610P
Article No.: 0HR610P
Ersa Reflow Process Camera for HR 600/2
for observation of the soldering process
With the Reflow Process Camera (RPC) you can observe the soldering and unsoldering processes in real time. The user can watch the molten solder and optimize the process parameters. The Ersa RPC increases the process safety.
10 MP CMOS USB color camera, 25 mm focal width; lighting: 2x LED point light source, dimmable.
K type for the second measuring channel
Article No.: 0IR6500-37
Article No.: 0IR6500-37
AccuTC Sensor without fixture
K type for the second measuring channel
Spare sensor or second sensor for temperature control of temperature-sensitive components in the environment of the repair solder joint; sensor diameter approx. 0.5 mm.
K type, for the second measuring channel
Article No.: 0HR645
Article No.: 0HR645
AccuTC 2.0 Thermocouple
K type, for the second measuring channel
The alternative to the AccuTC for measures at Hybrid Rework Systems with big air volumes and for measures at high-mass plates; sensor diameter approx. 2 mm.
K type, for the second measuring channel
Article No.: 0IR4510-02
Article No.: 0IR4510-02
Temperature Sensor Cord
K type, for the second measuring channel
Sensor to observe the plate bottom side or for mounting at temperature-sensitive components. The sensor can be stuck with Kapton tape; sensor diameter approx. 0.3 mm.
suitable for AccuTC and AccuTC 2.0
Article No.: 0HR640
Article No.: 0HR640
TE Holder for HR 600
suitable for AccuTC and AccuTC 2.0
Hinged bracket with four pivots for easy and secure positioning of the AccuTC temperature sensor on the plate; you can use the holder with the other Ersa Rework Systems, too.
for plate size up to 300 x 535 mm
Article No.: 0HR635
Article No.: 0HR635
PCB Holder HR 600/2 (big)
for plate size up to 300 x 535 mm
Intake of bigger plates at the HR 600/2. NOTE: not the entire size of the holder is preheated from the bottom. Some regions cannot be reached by heating- or placement head as the axis system remains unchanged.
Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm
Article No.: 0IR5500-40 + 0IR4520-07
Article No.: 0IR5500-40 + 0IR4520-07
Micro-Pickup Type 0510
Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm
The all-metal micro-nozzle 0IR5500-40 has an outer diameter of 0.9 mm and an inner diameter of 0.5 mm. It can be directly used for lift-off of small chip components and similar.
In case of a component has high adhesion force by large area bottom connections, the 1 mm silicone suction cup 0IR4520-07 can be used with the nozzle. The improved sealing creates a higher vacuum force during lift-off.
Additional products
More accessories you will find in the Ersa Shop.
Available Versions
The following product versions or modules are available:
Article No.: 0HR600/2
HR 600/2 Hybrid Rework System
Hybrid Rework System HR 600. Figure shows accessory Reflow Process Camera (0HR610), not included in delivery.
Article No.: 0HR600/2BHL
HR 600/2 with lowered bottom heating
For the treatment of PCBs with high components on the bottom side. The downward clearance increases from 30 to 65 mm. Caution: Solder profiles have to be adjusted.
Article No.: 0HR600/2L
HR 600/2 with PCB holder 300 x 535 mm
Treatment of bigger PCBs. NOTE: not the entire size of the holder is preheated from the bottom. Some regions cannot be reached by heating- or placement head as the axis system remains unchanged.
Article No.: 0HR600/2LBHL
HR 600/2 with PCB holder 300 x 535 mm and lowered bottom heating
Treatment of bigger PCBs. NOTE: not the entire size of the holder is preheated from the bottom. Some regions cannot be reached by heating- or placement head as the axis system remains unchanged.
For the treatment of PCBs with high components on the bottom side. The downward clearance increases from 30 to 65 mm. Caution: Solder profiles have to be adjusted.
Article No.: 0HR600/2 and 0HR-VL1
HR600/2 VOIDLESS
System with integrated VOIDLESS-module to reduce gas enclosures in hidden solderjoints, especially of BTC (bottom terminated components).
Every HR 600/2 is retrofittable with the VOIDLESS module.
Further information upon request.