The preheating zone is used for thermal conditioning of the assembly to be soldered for the actual soldering process. In other words, the aim is to bring components of different sizes to a common temperature and to activate the flux in the solder paste. The preheating zone creates optimal conditions for the immediately following soldering process.
Process gas cleaning: The purity of the process zone is the primary objective in the reflow process, as it is a decisive factor in determining machine availability as well as the stability and reproducibility of the soldering processes. Impurities in the process gas atmosphere have various origins. The two most important sources are the solder pastes and the base materials of the printed circuit boards. The elementary task of the no-clean management system is to remove these residues from the process gas atmosphere so that neither assemblies nor the process chamber are contaminated by deposits.