Article No.: 0SC550
non-contact solder removal for
HR 550 and HR 550 XL



Ersa Rework - HR 550 product video


Removing residual solder without contact

 For HR 550 and HR 550 XL

  • High-quality 400 W hot gas/vacuum cartridge in suction head
  • Spacious solder collecting tank
  • Process gas cleaning
  • Integration possible in HR 550 or HR 550 XL
  • Process control via HRSoft 2 and clearly arranged operating elements


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Technical Data

Base station
Dimensions (W x D x H) in mm
300 x 210 x 420 mm
required table space approx. 600 x 500 mm
Weight in kg
Antistatic Design (y/n)
Power Rating in W
Nominal voltage in V AC
Upper heating
hot gas
Compressed air connection
60 l/min at 6 bar, oil free, quick coupling ¼ inch
Component size in mm
all common SMD pad formats
set elements and HRSoft 2
Test symbol


Remove residual solder

After desoldering of SMDs the PCB can remain inserted in the rework system while the residual solder is gently succed from its surface.
The printed circuit board is kept on a defined temperature the solder molten by use of a hot gas stream and captured by a vacuum device.
The guidance of the sucction nozzle is manually for the HR 550 and motorized (joy stick control) for the HR 550 XL.

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