Modular machine platform for highly flexible inline selective soldering of XL boards



Selective Soldering System Ersa VERSAFLOW 3/45

Ersa Selective Soldering VERSAFLOW 3/45


Highlights Selective Soldering System VERSAFLOW 3/66:


  • High-end selective soldering system to integrate into in-line manufacturing concepts
  • Maximum PCB size: 610 x 610 mm (24″ x 24″)
  • Parallel process through separation of fluxing, preheating and soldering
  • Use of up to 4 flux spray heads
  • Flexible system configuration due to modular machine design
  • Ideal for linking to manual workstations or peripheral equipment
  • Secure process control with monitoring of all relevant parameters
  • CAD Assistant for offline programming
  • Link for traceability systems for process control


... VERSAFLOW 3/66

In order to meet all requirements in terms of flexibility, the third generation VERSAFLOW has been created as a modular platform. The VERSAFLOW 3/66 belongs to this generation of machines and is especially designed for the selective soldering of PCBs in “XL” format. PCBs with dimensions of up to 610 mm x 610 mm pose no problem for this modern soldering system.


Doubling the throughput rate, maximum flexibility
Both preheating and solder modules with single wave pots can be additionally equipped with top-side heating systems. Thanks to the dual-track option, the throughput rate can be doubled without increasing the footprint of the machine. If the size of the assembly also allows segmentation of the preheating modules, a further increase in throughput is possible. These options enable the VERSAFLOW 3/66 to achieve extremely short amortization periods and offer the highest throughput rates currently available in the market of selective soldering systems, coupled with maximum flexibility in electronics assembly manufacturing.


  • Roller conveyor for direct board handling
  • Programmable conveyor width adjustment
  • Precision Drop-Jet Fluxer, up to 2 x/y modules, up to 4 spray heads per module
  • Maximum permissible board weight: 20 kg
  • 2 different flux media for each module
  • Up to 5 preheat modules
  • IR preheater individually configurable, top- and bottom-side convection heaters
  • Pyrometer for temperature monitoring
  • Up to 3 solder modules with 2 solder pots each for mini-wave and mini-dip applications
  • Transfer of board data from the CAD system

Techn. Data

Dimensions (basic machine)

  • Length: 2,950 mm
  • Width approx. 1,900 mm
  • Height approx. 1,650 mm

Conveyor system

  • Segmented pin-and-chain/roller conveyor
  • PCB width: 63.5-610 mm
  • PCB length: 127-610 mm
  • Maximum PCB top-side clearance: 120 mm
  • Maximumg PCB bottom-side clearance: 60 mm (30 mm with z-variable modules)
  • Maximum PCB weight: 5 kg (option: 15 kg)

Media supply

  • Nitrogen
  • Pneumatic system
  • Electric supply
  • Extracted air


Drop-Jet in different sizes


Dynamic IR emitters, convection or combination of IR and convection

Solder module

  • Electromagnetic solder pot
  • 3 modules with up to 6 mini-wave pots, solder volume 13 kg per 6 pot



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Your contact persons for the process
Product Management Ersa Soldering Systems Germany