Includes reference image and problem solution database. Inspect - Categorize - Analyze - Document
High flexibility and speed with hand-held inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.
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