Ersa MOBILE SCOPE optical inspection system

Hand-guided system for fast inspection of hidden solder joints

Article No.: 0VSSC060VK(x)

Compact, portable video microscope for inspecting solder joints in electronics manufacturing. It is designed for optical inspection and digital image recording as well as measurement tasks on solder joints of ball grid array (BGA), μBGA, CSP and flip chip devices.

Technology Highlights

Mobile inspection system with two quick-change objectives (depending on equipment):
- 90° BGA optics (approx. 280 µm gap)
- 0° macro zoom inspection optics
Fast, hand-guided inspection of hidden solder joints
Integrated, dimmable LED illumination
N-MOS color camera 5 megapixel, with USB connection
Additional LED fiber light included with BGA optics
Ideal for inspection at constantly changing locations and for servicing
Ersa ImageDoc v3 inspection software (basic version) included

Application: Inspection of hidden solder joints and more

High flexibility and speed with handheld inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices.

Specifications
Ersa inspection systems

Ersa MOBILE SCOPE basic unit

Dimensions (LxWxH) mm: 114 x 36 x 51 (without cable)
Weight in g: 210
Principle: integrated optical system with built-in camera and LED light source
Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics)
Light control: potentiometer (0-100%)
Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment
Focus adjustment: integrated focus ring on optics
Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics

Interchangeable optics 90° BGA module

Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90°.
Application: Inspection of hidden solder joints with gap dimensions from 50 to 1,500 µm (BGA, PLCC, QFP etc.)
Total length in mm: 83
Weight in g: 60
Magnification: up to 15x - 180x (on 14" monitor)
Footprint: 8.2 x 0.8 mm
Focus range: 0.5-30 mm

Interchangeable optics 90° supervisory module

Design: integrated zoom optics, built-in dimmable LED illumination, distance pin with three distance levels
Application: fast, flexible supervisory inspection at high magnification
Total length in mm: 43 (with telecopic support max. 85)
Weight in g: 35
Magnification: 8x - 80x (14" monitor)
Focus range: 5-200 mm

Inspection camera

Design: 1/3" N-MOS solid state color image sensor, permanently integrated in MOBILE SCOPE base unit

Battery light source

Design: LED fiber light, cool white power LED, 64x 0.25mm plastic optical fiber
Lifetime: min. 5,000 hours
Power supply: 3x AA batteries (LR06, alkaline recommended)
Approval mark: CE
Weight in g: approx. 220 (incl. batteries)
Design antistatic (y/n): yes
Dimensions (WxH) in mm: diameter 26 (40) x 250

ERSASCOPE - optical solder joint inspection

Uniquely efficient: optical inspection of solder joints with Ersa's patented systems - the ideal complement to X-ray inspection of BGAs!

Optical inspection system Ersa MOBILE SCOPE

Hand-guided system for fast inspection of hidden solder joints

Technology Highlights

Application: Inspection of hidden solder joints and more