Ersa Rework

Ersa Dip&Print Station

Ersa Dip&Print Station

Defined flux or solder paste application during rework

Article-No.: 0PR100

The Ersa Dip&Print Station enables the user of Ersa Rework Systems to perform component preparation (application of solder paste and flux) easily, reliably and reproducibly. Optional dip stencils allow components to be dipped into flux or solder paste in a defined manner, thus creating a defined depot of solder connections.

Prepared for all rework cases

From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs - Ersa rework systems offer the optimal solution for all applications.

Ersa Dip&Print Station

Available options

  • Order no. - Description
    • 0PR100-D001    Dip stencil 40 x 40 / 300 µm
    • 0PR100-D002    Dip stencil 20 x 20 / 150 µm
    • 0PR100-D003    Dip stencil 20 x 20 / 100 µm
    • 0PR100-D004    Dip stencil 40 x 40 / 100 µm
    • 0PR100-R001    Squeegee 70 x 25 mm, 0.3 mm thick
    • 0PR100-S001    Print stencil, Type 1, BGA 225
    • 0PR100-S002    Print stencil Type 2, MLF 32
    • 0PR100-S003    Print stencil Type 2, QFN 20

Further dip and print stencils available - customer specific stencils upon request.

Ersa Rework System HR 600 XL

At minute 1:00 - a BGA is uniformly wetted with flux using a dip stencil.

Rework per Live-Demo

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