Ersa Rework

Ersa Dip&Print Station

Defined flux or solder paste application during rework

Article No.: 0PR100

The Ersa Dip&Print Station enables the user of Ersa rework systems to perform component preparation (application of solder paste and flux) easily, reliably and reproducibly. Optional dip stencils allow components to be dipped into flux or solder paste in a defined manner, thus creating a defined depot of solder connections.

Rework circuit board formats*

From S to M and L to XL.

*PCB format: length times width (each approx. max. limit): S = 300 x 250 mm; M = 390 x 285 (+x) mm; L = 535 x 300 mm; XL = 625 x 625 mm.

Specifications
Ersa Dip&Print Station

Available options

  • Order no. - Description
    • 0PR100-D001    Dip stencil 40 x 40 / 300 µm
    • 0PR100-D002    Dip stencil 20 x 20 / 150 µm
    • 0PR100-D003    Dip stencil 20 x 20 / 100 µm
    • 0PR100-D004    Dip stencil 40 x 40 / 100 µm
    • 0PR100-PL550    Frame fixation PL 550
    • 0PR100-PL650    Frame fixation PL 650
    • 0PR100-R001    Squeegee 70 x 25 mm, 0.3 mm thick
    • 0PR100-S001    Print stencil, Type 1, BGA 225
    • 0PR100-S002    Print stencil Type 2, MLF 32
    • 0PR100-S003    Print stencil Type 2, QFN 20

Rework via live demo

Watch the video and make an individual appointment for a live demo online - simply contact info(at)ersa.de

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