Ersa Rework

Automatic Big Board Rework System Ersa HR 600 XL

Automatic Rework System HR 600 XL

Automatic repair of complex assemblies up to 625 x 625 mm

Article-No.: 0HR600XL

The Ersa Rework System HR 600 XL was developed for large PCB formats - components up to 60 x 60 mm can be processed just as easily as precisely. With the optionally available XL heating head, even components up to 120 x 120 mm edge length can be processed.

Auto Scavenger for Reworksystem HR 600 XL

"Auto Scavenger" removes the residual solder automatically without any contact

After desoldering a component, any remaining solder usually has to be removed. With the "Auto Scavenger" module, there is now a fully integrated functional unit for this – immediately after removing the component, the suction nozzle of the Auto Scavenger is lowered over the circuit board and the residual solder is automatically removed without any contact.

Auto Scavenger and Rewor System HR 600

Auto Scavenger - no set-up time!

As the Auto Scavenger is a stand-alone module, there is no set-up time for the user. The image collage opposite shows the process (from left to right) from the start with the lifting of a BGA, through the progress of the solder extraction, to the complete removal of the residual solder.

Prepared for all rework cases

From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs - Ersa rework systems offer the optimal solution for all applications.

Specifications Rework System Ersa HR 600 XL

Technical data HR 600 XL

  • Dimensions (W x D x H) in mm: 2250 x 1700 x 1650 incl. Monitor holder
  • Footprint: 1691 x 1180 mm
  • Weight in kg: approx. 312
  • Antistatic Design (y/n): yes
  • Power Rating in W: 16 kW, optional 16 kW + 15 kW
  • Nominal voltage in V AC: 400, 3 phase, 50/60 Hz, 30 A
  • Compressed air connection: 6-10 bar (free of oil), 1/4 inch quick bar connect
  • Volume of air cooling: approx. 110 l/min (@ 6 bar)
  • Upper heating: Hybrid emitter 60 x 60 mm (0,8 kW), optional up to 150 x 120 mm (2,8 kW)
  • Lower heating: IR emitter 625 x 625 mm (25 x 600 W), optional 625 x 625 1250 mm (50 x 600 W)
  • PCB size in mm: up to 625 x 625 mm, optional up to 625 x 1250 mm
  • PCB thickness: up to 10 mm
  • Component size in mm: from 0.5 x 0.5 up to 60 x 60, optional from 01005 up to 150 x 120 mm
  • Operation: Windows PC, HRSoft 2
  • Test symbol: CE, optional UL
  • Option: reflow process camera: 5 MP GigE color camera, 25 mm focal width; lighting: 2x LED light source

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