For the efficient use of power semiconductors such as IGBTs, the optimum electrical connection to the PCB and a high-quality thermal connection to the heat sink (housing or heat sink) must be created. The ideal combination for a high-quality assembly process is the VERSAFIT 500 press-fit system for the electrical connection and the VERSAPRINT 2 TIM (Thermal Interface Material) stencil printer for the thermal connection for heat dissipation.
After the press-fit process, the assembly is automatically transported to the printer, where thermal paste is printed onto the IGBTs. The direct coupling of the press-fit and printing process saves handling steps and increases the throughput of the line. The VERSAPRINT 2 TIM offers all the advantages of stencil printing combined with precise process parameters for optimum processing of thermal pastes. This achieves reproducible volume application, which can also be monitored using the printer´ s integrated inspection system. Together, VERSAFIT 500 and VERSAPRINT 2 TIM form a high-performance team for power electronics applications.
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